参数资料
型号: BCM352F125M300A00
厂商: Vicor Corporation
文件页数: 16/18页
文件大小: 0K
描述: HV BCM BUS CONVERT 12.5V 300W
应用说明: Factorized Power Architecture and V-I Chips
产品培训模块: VI Chip Bus Converter Modules
标准包装: 1
系列: V-I Chip™, BCM™
类型: 总线转换器模块
输出数: 1
电压 - 输入(最小): 330V
电压 - 输入(最大): 365V
输出电压: 12.5V
电流 - 输出(最大): 24A
电源(瓦) - 制造商系列: 300W
电压 - 隔离: 4.242kV(4242V)
应用: 商用
特点: 具有远程开/关功能和 UVLO
安装类型: 表面贴装
封装/外壳: 模块
尺寸/尺寸: 1.28" L x 0.87" W x 0.26" H(32.5mm x 22.0mm x 6.7mm)
包装: 托盘
工作温度: -55°C ~ 125°C
效率: 95.3%
电源(瓦特)- 最大: 300W
重量: 0.031 磅(14.06g)
BCM 352 x 125 y 300 A00
8.0 INPUT AND OUTPUT FILTER DESIGN
A major advantage of SAC? systems versus conventional
PWM converters is that the transformers do not require large
functional filters. The resonant LC tank, operated at extreme
high frequency, is amplitude modulated as a function of input
voltage and output current, and efficiently transfers charge
through the isolation transformer. A small amount of
capacitance, embedded in the input and output stages of the
module, is sufficient for full functionality and is key to achieve
power density.
This paradigm shift requires system design to carefully evaluate
external filters in order to:
Total load capacitance at the output of the bus converter shall
not exceed the specified maximum. Owing to the wide
bandwidth and low output impedance of the module, low
frequency bypass capacitance and significant energy storage
may be more densely and efficiently provided by adding
capacitance at the input of the module. At frequencies <500
kHz the module appears as an impedance of R OUT between the
source and load.
Within this frequency range capacitance at the input appears
as effective capacitance on the output per the relationship
defined in Eq. 5.
1. Guarantee low source impedance:
To take full advantage of the BCM ? bus conveter dynamic
response, the impedance presented to its input terminals
C OUT =
C IN
K 2
Eq. 6
must be low from DC to approximately 5 MHz. The
1 μF in series with 0.3 Ω . A single electrolytic or equivalent
connection of the module to its power source should be
implemented with minimal distribution inductance. If the
interconnect inductance exceeds 100 nH, the input should
be bypassed with a RC damper to retain low source
impedance and stable operation. With an interconnect
inductance of 200 nH, the RC damper may be as high as
low-Q capacitor may be used in place of the series RC
bypass.
2. Further reduce input and/or output voltage ripple without
sacrificing dynamic response:
Given the wide bandwidth of the bus converter, the source
response is generally the limiting factor in the overall
system response. Anomalies in the response of the source
will appear at the output of the module multiplied by its
K factor. This is illustrated in Figures 11 and 12.
3. Protect the module from overvoltage transients imposed
by the system that would exceed maximum ratings and
cause failures:
The VI Chip ? module input/output voltage ranges shall
not be exceeded. An internal overvoltage lockout function
prevents operation outside of the normal operating input
range. Even during this condition, the powertrain is exposed
to the applied voltage and power MOSFETs must withstand
it. A criterion for protection is the maximum amount of
energy that the input or output switches can tolerate if
avalanched.
This enables a reduction in the size and number of capacitors
used in a typical system.
BCM ? Bus Converter
Page 16 of 18
Rev 1.7
1/2013
vicorpower.com
800 735.6200
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BCM352T125M300A00 功能描述:HV BCM BUS CONVERT 12.5V 300W RoHS:是 类别:电源 - 板载 >> DC DC 转换器(分解式) 系列:V-I Chip™, BCM™ 应用说明:Factorized Power Architecture and V-I Chips 产品培训模块:VI Chip Bus Converter Modules 标准包装:1 系列:V-I Chip™, BCM™ 类型:总线转换器模块 输出数:1 电压 - 输入(最小):330V 电压 - 输入(最大):365V 输出电压:12.5V 电流 - 输出(最大):24A 电源(瓦) - 制造商系列:300W 电压 - 隔离:4.242kV(4242V) 应用:商用 特点:具有远程开/关功能和 UVLO 安装类型:通孔 封装/外壳:模块 尺寸/尺寸:1.28" L x 0.87" W x 0.26" H(32.5mm x 22.0mm x 6.7mm) 包装:托盘 工作温度:-55°C ~ 125°C 效率:95.3% 电源(瓦特)- 最大:300W 重量:0.031 磅(14.06g)