参数资料
型号: BD00HC0WEFJ-E2
厂商: Rohm Semiconductor
文件页数: 14/20页
文件大小: 0K
描述: IC REG LDO ADJ 1A 8-HTSOP
特色产品: CMOS LDO Regulators
标准包装: 1
稳压器拓扑结构: 正,可调式
输出电压: 0.8 V ~ 7 V
输入电压: 4.5 V ~ 8 V
电压 - 压降(标准): 0.6V @ 1A
稳压器数量: 1
电流 - 输出: 1A(最小值)
工作温度: -25°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm Width)裸露焊盘
供应商设备封装: 8-HTSOP-J
包装: 标准包装
其它名称: BD00HC0WEFJ-E2DKR
BD00HC0WEFJ
Datasheet
● Operational Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the device, thus making it impossible to identify the damage mode, such as a short circuit or an open circuit.
If there is any possibility of exposure over the rated values, please consider adding circuit protection devices such as
fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage the IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
(3) Power supply lines
Design the PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply
line, separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply
terminals to ICs, connect a capacitor between the power supply and GND terminal. When using electrolytic capacitors in
a circuit, note that capacitance values are reduced at low temperatures and over time.
(4) GND voltage
The potential of the GND pin must be minimum potential under all operating conditions.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
(6). Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
(7). Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(8). ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(9). Thermal shutdown circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is
designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation.
Do not continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit
is assumed.
TSD ON Temperature[ ℃ ] (typ.)
Hysteresis Temperature [ ℃ ]
(typ.)
BD00HC0WEFJ
175
15
(10). Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic
measure. Use similar precaution when transporting or storing the IC.
www.rohm.com
? 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
14/17
TSZ02201-0R6R0A600060-1-2
17.Jan.2013 Rev.002
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