参数资料
| 型号： | BD3951F-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 6/12页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 5V .15A 8SOP |
| 标准包装： | 2,500 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 5V |
| 输入电压： | 6 V ~ 20 V |
| 电压 - 压降（标准）： | 0.31V @ 100mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 150mA（最小） |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.173"，4.40mm 宽） |
| 供应商设备封装： | 8-SOP |
| 包装： | 带卷 (TR) |
BD3951F
● Thermal Design
1000
800
687
600
400
200
Glass Epoxy Board (70mm × 70mm × 1.6mm)
Mount Condition Θ j-a=181.8 ( ℃ /W)
Technical Note
0
0
25
50
75
100
125
150
Ta
[ ℃ ]
Fig.17
Please consider about power dissipation de-rating curve for high temperature operations. IC characteristics receive great
effect from operating ambient temperature. If junction temperature exceeds rating temperature (Tjmax), device might
degrade or be demolished permanently. Heat design should take consideration from both instant demolish and long life
reliability.To prevent thermal destroy, IC must be operated under the condition that junction temperature is less than Tjmax.
SOP8 package power dissipation temperature de-rating curve is shown in Fig. 17. Operating condition must be less than
power dissipation curve. Calculation formula is as below.
Pc=(Vcc-VOUT)×IOUT+Vcc×Icc
Power Dissipation Pd ≤ Pc
Derive IOUT as operation is less than power dissipation curve,
Pd-Vcc×Icc
IOUT ≤
(Icc is shown in Fig. 1)
Vcc-VOUT
Vcc
VOUT
IOUT
Icc
:
:
:
:
Input Voltage
Output Voltage
Output Current
Circuit Current
IOUT max is defined by Vcc and VOUT.
·Example
Ta=85 ℃ , Vcc=13.5V and VOUT=5V
0.357-13.5×Icc
IOUT ≤
13.5-5
IOUT ≤ 41.8mA (Icc=135 μ A)
θ ja=181.8 ℃ /W → -5.5mW/ ℃
25 ℃ =687mW → 85 ℃ =357mW
Power consumption (Pc) has to be less than power dissipation curve along with the temperature.
The equation under short circuit condition (VOUT-GND short) is as below.
Pc=Vcc×(Icc+Ishort) Ishort=Short Current
www.rohm.com
? 2009 ROHM Co., Ltd. All rights reserved.
6/9
2009.07 - Rev.A
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