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参数资料
| 型号： | BD6142AMUV-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 22/33页 |
| 文件大小： | 0K |
| 描述： | IC LED DRIVER SGL STEP UP 24QFN |
| 标准包装： | 2,500 |
| 拓扑： | PWM，升压（升压） |
| 输出数： | 8 |
| 内部驱动器： | 是 |
| 类型 - 主要： | 背光 |
| 类型 - 次要： | 白色 LED |
| 频率： | 1MHz ~ 1.5MHz |
| 电源电压： | 4.2 V ~ 27 V |
| 输出电压： | 41V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-VFQFN 裸露焊盘 |
| 供应商设备封装： | VQFN024V4040 |
| 包装： | 带卷 (TR) |
| 工作温度： | -40°C ~ 85°C |
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BD6142AMUV
Datasheet
● Layout
In order to make the most of the performance of this IC, its PCB layout is very important. Characteristics such as efficiency
and ripple and the likes change greatly with layout patterns, which please note carefully.
7V to 27V
CIN(10μF)
L1(10μH)
SBD
CVDC1
VOUT
10 serial x 8 parallel (80pcs)
COUT1(2.2μF/50V)
(2.2μF)
LX
LX
FAULT
VIN
VDC
2.1V to VIN
ROVP1
(2.2M ? )
RESET
PWM
f PWM =100Hz~25kHz
ENABLE
PWM
OVP
ROVP2
(68k ? )
RCMP(1k ? )
CCMP(22nF)
COMP
BD6142AMUV
CH1
CH2
CH3
CH4
CH5
CH6
CH7
PGND
PGND
GND
TEST FSET
ABC
ISET
CH8
20mA
RISET(36k ? )
GND
PGND
RFSET(56k ? ) CABC(1nF)
Figure 35. Schematic
<Input bypath capacitor CIN (10 μ F)>
Put input bypath capacitor CIN (10 μ F) as close as possible between coilL1 and PGND pin.
<Smoothing capacitor CVDC1(2.2μF) of the regulator>
Connect smoothing capacitor CVDC1(2.2 μ F) as close as possible between VDC pin and GND.
<Schottky barrier diode SBD>
Connect schottky barrier diode SBD as close as possible between coil1and LX pin.
<Output capacitor COUT1>
Connect output capacitor COUT1 between cathode of SBD and PGND.
Make both PGND sides of CVIN and COUT1 as close as possible.
<LED current setting resistor RISET(36k ? )>>
Connect LED current setting resistor RISET(36k ? ) as close as possible between ISET pin and GND.
There is possibility to oscillate when capacity is added to ISET terminal, so pay attention that capacity isn’t
added.
<Analog dimming pin smoothing capacitor CABC (1nF)>
Put analog dimming pin smoothing capacitor CABC (1nF) close to ABC pin and do not extend the wiring to prevent noise
increasing and also LED current waving.
<Frequency setting resistor(56K ? )>
Put frequency setting resistor(56K ? ) as close as possible between FSET pin and GND.
<Over voltage limit setting resistor ROVP1(2.2M ? ) and ROVP2(68K ? )
Put over voltage limit setting resistor ROVP1(2.2M Ω ) and ROVP2(68K ? ) as close as possible to OVP pin and do not
extend the wiring to prevent noise increasing and also detecting over voltage protection in error.
<GMAMP setting resistor RCMP(1k ? ) and CCMP(1nF) for phase compensation >
Put GMAMP setting resistor RCMP(1K ? ) and CCMP(22nF) as close as possible to COMP pin and do not extend the
wiring to prevent noise increasing and also oscillating.
<Connect to GND and PGND>
GND is analog ground, and PGND is power ground. PGND might cause a lot of noise due to the coil current of PGND.
Try to connect with analog ground, after smoothing with input bypath capacitor CVIN and output capacitor COUT1.
<Heat radiation of back side PAD>
PAD is used for improving the efficiency of IC heat radiation. Solder PAD to GND pin (analog ground).
Moreover, connect ground plane of board using via as shown in the patterns of next page.
The efficiency of heat radiation improves according to the area of ground plane.
<Others>
When those pins are not connected directly near the chip, influence is give to the performance of BD6142AMUV, and
may limit the current drive performance. As for the wire to the inductor, make its resistance component small so as to
reduce electric power consumption and increase the entire efficiency.
www.rohm.com
? 2011 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
22/30
TSZ02201-0G3G0C400340-1-2
03.Dec.2012 Rev.001
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