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参数资料
| 型号： | BD6231HFP |
| 元件分类： | 运动控制电子 |
| 英文描述： | BRUSH DC MOTOR CONTROLLER, 1 A, PSSO8 |
| 封装： | HRP-7 |
| 文件页数： | 4/17页 |
| 文件大小： | 713K |
| 代理商： | BD6231HFP |
12/16
Thermal design
Fig.43 Thermal derating curve
Fig.44 Thermal derating curve
Fig.45 Thermal derating curve
(SOP8)
(SSOPB24)
(HRP7)
Fig.46 Thermal derating curve
Fig.47 Thermal derating curve
(HSOP25)
(HSOPM28)
Thermal design needs to meet the following operating conditions.
In creating the thermal design, sufficient margin must be provided to guarantee the temperature conditions below.
1. The ambient temperature Ta must be 85°C or below
2. The junction temperature Tj must be 150°C or below
The junction temperature Tj can be determined using the following equation.
Tj Ta + j-a x Pc [°C]
The power consumption Pc can be determined using the following equation. Refer to page 4 about VON(H) and VF(H).
Pc (IOUT
2 x RON) x (VREF / VCC) + IOUT x (VON(H) + VF(H)) x (1 - VREF / VCC) + VCC x ICC [W]
Example using the BD6232FP
Conditions: Ta=50°C, VCC=VREF=24V, Iout=0.5A.
The power consumption of the IC and the junction temperature are as follows:
Pc 0.5
2 x 1.0 + 24 x 1.3m = 281mW
Tj 50 + 86.2 x 281m = 74 [°C]
Where the Tjmax parameter is 150°C and the derating is set to 80 percents, the maximum ambient temperature
Tamax is determined as follows.
Ta Tjmax x 0.8 - j-a x Pc 96 [°C]
In this example, thermal design can be considered satisfactory (meaning that there are no problems in thermal design),
since the system meets the operating temperature conditions.
Table 9 Thermal resistance
Package
j-a [°C/W]
SOP8
182
SSOPB24
122
HRP7
89.3
HSOP25
86.2
HSOP28
56.8
Mounted on a 70mmx70mmx1.6mm FR4 glass-epoxy
board with less than 3% copper foil.
0.0
0.5
1.0
1.5
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [°C]
Pd
[W]
i) 0.562W
ii) 0.687W
i) Package only
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
0.0
2.0
4.0
6.0
8.0
10.0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [°C]
Pd
[W]
i) Package only (copper foil: 10.5mm x 10.5mm)
ii) 2 layers PCB (copper foil: 15mm x 15mm)
iii) 2 layers PCB (copper foil: :70mm x 70mm)
iv) 4 layers PCB (copper foil: 70mm x 70mm)
i) 1.4W
ii) 2.3W
iii) 5.5W
iv) 7.3W
0
1
2
3
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [°C]
Pd
[W]
i) 0.85W
ii) 1.45W
i) Package only
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
0
1
2
3
0
25
50
75
100
125
150
AMBIENT TEMPERATURE [°C]
Pd
[W]
i) 1.80W
ii) 2.20W
i) Package only
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
0.0
0.5
1.0
1.5
025
50
75
100
125
150
AMBIENT TEMPERATURE [°C]
Pd
[W]
i) 0.787W
ii) 0.976W
i) Package only
ii) Mounted on ROHM standard PCB
(70mm x 70mm x 1.6mm FR4 glass-epoxy board)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| BD6231HFP-TR | 功能描述:马达/运动/点火控制器和驱动器 H-BRIDGE 36V max 1 Chan 1.0A 1.5ohm RoHS:否 制造商:STMicroelectronics 产品:Stepper Motor Controllers / Drivers 类型:2 Phase Stepper Motor Driver 工作电源电压:8 V to 45 V 电源电流:0.5 mA 工作温度:- 25 C to + 125 C 安装风格:SMD/SMT 封装 / 箱体:HTSSOP-28 封装:Tube |
| BD6232 | 制造商:ROHM 制造商全称:Rohm 功能描述:H-bridge drivers (36V max.) |
| BD62321HFP | 制造商:ROHM 制造商全称:Rohm 功能描述:H-bridge driver |
| BD62321HFP-TR | 功能描述:IC H-BRIDGE DVR 36V 1CH 3A HRP7 RoHS:是 类别:集成电路 (IC) >> PMIC - 电机和风扇控制器，驱动器 系列:- 标准包装:1 系列:- 应用:直流电机驱动器，步进电机驱动器 评估套件:- 输出数:1 或 2 电流 - 输出:750mA 电压 - 负载:10 V ~ 40 V 电源电压:4.5 V ~ 5.5 V 工作温度:-20°C ~ 70°C 安装类型:表面贴装 封装/外壳:24-BFSOP（0.295"，7.50mm 宽） 供应商设备封装:24-SOP 包装:Digi-Reel® 其它名称:MTS62C19A-HS105DKR |
| BD6232FP | 制造商:ROHM 制造商全称:Rohm 功能描述:H-Bridge Motor Drivers For DC Brush Motors |
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