参数资料
型号: BD6586MUV-E2
厂商: Rohm Semiconductor
文件页数: 9/23页
文件大小: 0K
描述: IC LED DRVR WHITE BCKLGT 24-VQFN
标准包装: 1
拓扑: PWM,升压(升压)
输出数: 4
内部驱动器:
类型 - 主要: 背光
类型 - 次要: 白色 LED
频率: 700kHz ~ 1.3MHz
电源电压: 2.7 V ~ 5.5 V
安装类型: 表面贴装
封装/外壳: 24-VFQFN 裸露焊盘
供应商设备封装: VQFN024V4040
包装: 标准包装
工作温度: -40°C ~ 85°C
产品目录页面: 1372 (CN2011-ZH PDF)
其它名称: BD6586MUV-E2DKR
BD6586MUV
Datasheet
● PCB Layout
In order to make the most of the performance of this IC, its layout pattern is very important. Characteristics such as
efficiency and ripple and the likes change greatly with layout patterns, which please note carefully.
to GND
to Power Supply
to Power Supply
C IN
L
SBD
C OUT
to Anode of LED
24
23
22
21
20
19
1
VBAT
18
SW
C VBAT
PWM
(100Hz~1000Hz)
2
EN1
3
EN2
Thermal Via
BD6586MUV
17
SW
16
SW
4
LE D6 LE D5
LED 4
LED 3
LE D2
15
GND
5
Thermal Via
N.C.
14
RISET
PWM
6
ISET
TEST0
13
TEST
7
8
9
10
11
12
to Anode of each LED
Figure 11. PCB Layout
Connect the input bypath capacitor CIN nearest to coil L and PGND, as shown in the upper diagram.
Ripple of a power supply is smoothed by CIN and connect stable voltage to VBAT terminal by the low resistance. Thereby,
the input voltage ripple of the IC can be reduced.
Connect CVBAT nearest to between the VBAT terminal and GND (4 pin) as shown in the upper diagram when you can't be
wired by the low resistance from CIN to VBAT pin
Connect schottky barrier diode SBD of the regulator nearest to between coil L and SW terminal.
And connect output capacitor COUT nearest to between CIN and GND pin. Thereby, the output voltage ripple of the IC can
be reduced.
GND terminal (4,7,10 pin) is connected inside the IC, and it is GND of the block except switching and a transistor.
A current drive performance may be restricted by influence of a noise, if PGND which is not smooth connected to GND.
A GND terminal is connected to the stable GND plane. And connect it to a GND plane after smoothing PGND by CIN and
COUT. GND and PGND are separated inside IC.
And connect it to a GND plane after smoothing PGND by CIN and COUT.
Connect the heat sink of IC to a GND plane through Thermal Via. And Connect with the largest possible pattern.
It is satisfactory even if it connects with the GND terminal of IC.
Connect LED current setting resistor RISET nearest to ISET pin. There is possibility to oscillate when capacity is added to
ISET terminal, so pay attention that capacity isn't added. And, RISET of GND side must be wired directly to GND(7pin) pin.
When those pins are not connected directly near the chip, influence is given to the performance of BD6586MUV, and may
limit the current drive performance. As for the wire to the inductor, make its resistance component small so as to reduce
electric power consumption and increase the entire efficiency.
A layout pattern in consideration of these is shown in page 10.
www.rohm.com
? 2012 ROHM Co., Ltd. All rights reserved.
TSZ22111 ? 15 ? 001
9/20
TSZ02201-0G3G0C400190-1-2
10.Dec.2012 Rev.001
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