参数资料
| 型号： | BD7003NUX-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 12/16页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .3A 8VSON |
| 特色产品： | CMOS LDO Regulators |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 1.5 V ~ 3.3 V |
| 输入电压： | 2.5 V ~ 5.5 V |
| 电压 - 压降（标准）： | 0.21V @ 300mA |
| 稳压器数量： | 2 |
| 电流 - 输出： | 300mA（最小） |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-UFDFN 裸露焊盘 |
| 供应商设备封装： | 8-VSON-EP（2x2） |
| 包装： | 标准包装 |
| 其它名称： | BD7003NUX-E2DKR |
BD7003NUX,BD7004NUX
Technical Note
● Notes for use
(1) Absolute maximum ratings
If applied voltage (VIN), operating temperature range (Topr), or other absolute maximum ratings are exceeded, there is
a risk of damage. Since it is not possible to identify short, open, or other damage modes, if special modes in which
absolute maximum ratings are exceeded are assumed, consider applying fuses or other physical safety measures.
(2) Recommended operating range
This is the range within which it is possible to obtain roughly the expected characteristics. For electrical characteristics,
it is those that are guaranteed under the conditions for each parameter. Even when these are within the recommended
operating range, voltage and temperature characteristics are indicated.
(3) Reverse connection of power supply connector
There is a risk of damaging the IC by reverse connection of the power supply connector. For protection from reverse
connection, take measures such as externally placing a diode between the power supply and the power supply pin of
the IC.
(4) Power supply lines
In the design of the board pattern, make power supply and GND line wiring low impedance.
When doing so, although the digital power supply and analog power supply are the same potential, separate the digital
power supply pattern and analog power supply pattern to deter digital noise from entering the analog power supply due
to the common impedance of the wiring patterns. Similarly take pattern design into account for GND lines as well.
Furthermore, for all power supply pins of the IC, in conjunction with inserting capacitors between power supply and GND
pins, when using electrolytic capacitors, determine constants upon adequately confirming that capacitance loss
occurring at low temperatures is not a problem for various characteristics of the capacitors used.
(5) GND voltage
Make the potential of a GND pin such that it will be the lowest potential even if operating below that. In addition,
confirm that there are no pins for which the potential becomes less than a GND by actually including transition
phenomena.
(6) Shorts between pins and misinstallation
When installing in the set board, pay adequate attention to orientation and placement discrepancies of the IC. If it is
installed erroneously, there is a risk of IC damage. There also is a risk of damage if it is shorted by a foreign substance
getting between pins , between a pin and a power supply or GND.
(7) Operation in strong magnetic fields
Be careful when using the IC in a strong magnetic field, since it may malfunction.
(8) Inspection in set board
When inspecting the IC in the set board, since there is a risk of stress to the IC when capacitors are connected to low
impedance IC pins, be sure to discharge for each process.
Moreover, when getting it on and off of a jig in the
inspection process, always connect it after turning off the power supply, perform the inspection, and remove it after
turning off the power supply. Furthermore, as countermeasures against static electricity, use grounding in the
assembly process and take appropriate care in transport and storage.
(9) Input pins
Parasitic elements inevitably are formed on an IC structure due to potential relationships. Because parasitic elements
operate, they give rise to interference with circuit operation and may be the cause of malfunctions as well as damage.
Accordingly, take care not to apply a lower voltage than GND to an input pin or use the IC in other ways such that
parasitic elements operate. Moreover, do not apply a voltage to an input pin when the power supply voltage is not
being applied to the IC. Furthermore, when the power supply voltage is being applied, make each input pin a voltage
less than the power supply voltage as well as within the guaranteed values of electrical characteristics.
(10) Ground wiring pattern
When there is a small signal GND and a large current GND, it is recommended that you separate the large current GND
pattern and small signal GND pattern and provide single point grounding at the reference point of the set so that voltage
variation due to resistance components of the pattern wiring and large currents do not cause the small signal GND
voltage to change. Take care that the GND wiring pattern of externally attached components also does not change.
(11) Externally attached capacitors
When using ceramic capacitors for externally attached capacitors, determine constants upon taking into account a
lowering of the rated capacitance due to DC bias and capacitance change due to factors such as temperature.
(12) Thermal shutdown circuit (TSD)
When the junction temperature becomes 180 ℃ (typ) or higher, the thermal shutdown circuit operates and turns the
switch OFF. The thermal shutdown circuit, which is aimed at isolating the IC from thermal runaway as much as possible,
is not aimed at the protection or guarantee of the IC. Therefore, do not continuously use the IC with this circuit
operating or use the IC assuming its operation.
(13) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in
actual states of use.
www.rohm.com
? 2012 ROHM Co., Ltd. All rights reserved.
12/13
2012.01 - Rev.C
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