参数资料
| 型号： | BD7003NUX-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 2/16页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO ADJ .3A 8VSON |
| 特色产品： | CMOS LDO Regulators |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，可调式 |
| 输出电压： | 1.5 V ~ 3.3 V |
| 输入电压： | 2.5 V ~ 5.5 V |
| 电压 - 压降（标准）： | 0.21V @ 300mA |
| 稳压器数量： | 2 |
| 电流 - 输出： | 300mA（最小） |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-UFDFN 裸露焊盘 |
| 供应商设备封装： | 8-VSON-EP（2x2） |
| 包装： | 标准包装 |
| 其它名称： | BD7003NUX-E2DKR |
BD7003NUX,BD7004NUX
Technical Note
● Power Dissipation
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of IC
are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the original
IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability. Therefore, be
sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.)
(VIN: Input voltage VOUT: Output voltage
IOUT(MAX): Maximum output current)
Measurement conditions
Evaluation Board 1 (Double-side Board)
Layout of Board for
Measurement
(Unit: mm)
Top Layer (Top View)
IC
Implementation
Position
Bottom Layer (Top View)
Power Dissipation
Thermal Resistance
1. 6
Evaluation Bord1
1. 4
1.36W
θ ja=91.9 ℃ /W
1. 2
1. 0
0. 8
0. 6
0. 4
0. 2
0. 0
1.36W
0
25
50
75
100
125
150
175
200
Ambient Temperature :Ta ( ℃ )
Fig.1. VSON008X2020 Power dissipation heat reduction characteristics (Reference)
* Please design the margin so that PMAX becomes is than Pd (PMAX ? Pd)
within the usage temperature range.
www.rohm.com
? 2012 ROHM Co., Ltd. All rights reserved.
2/13
2012.01 - Rev.C
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