参数资料
型号: BD9850FVM-TR
厂商: Rohm Semiconductor
文件页数: 13/17页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM 8-MSOP
标准包装: 1
PWM 型: 控制器
输出数: 1
频率 - 最大: 2MHz
电源电压: 4 V ~ 9 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 85°C
封装/外壳: 8-VSSOP,8-MSOP(0.110",2.80mm 宽)
包装: 标准包装
其它名称: BD9850FVM-DKR
BD9850FVM-DKR-ND
BD9850FVMDKR
BD9851EFV
1PIN (SEL1)
2PIN (RT)
7,13PIN (DTC2,DTC1)
Vcc
Vcc
Vcc
V REF
V REF
Vcc
Vcc
SEL1
9PIN (OUT2)
RT
3PIN (CT)
DTC
4PIN (NON2)
Vcc
Vcc
PVcc2
V REF V CC
V REF
V REF
V REF
V REF
V REF
V REF
Vcc
Vcc
OUT2
11PIN (OUT1 )
PGND
CT
14PIN (SCP)
NON2
5,16PIN (INV2,INV1)
Vcc
Vcc
PVcc1
V REF
Vcc
V REF
Vcc
V REF
Vcc
Vcc
OUT1
6,15PIN (FB2,FB1)
SCP
17PIN (V REF )
INV
19PIN (STB)
V REF
Vcc
V REF
V REF
Vcc
Vcc
Vcc
Vcc
STB
FB
V REF
Fig.27 Equivalent circuit (BD9851EFV)
Cautions on use
1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down the devices,
thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will expect to exceed the
absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2) GND potential
Ground-GND potential should maintain at the minimum ground voltage level. Furthermore, no terminals should be lower than the GND potential
voltage including an electric transients.
3) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or if positive
and ground power supply terminals are reversed. The IC may also be damaged if pins are shorted together or are shorted to other circuitís power
lines.
5) Operation in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
6) Thermal shutdown circuit (TSD circuit)
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit (TSD circuit) is designed only to shut the IC off
to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating
this circuit or use the IC in an environment where the operation of this circuit is assumed.
7) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress. Always discharge
capacitors after each process or step. Always turn the IC's power supply off before connecting it to, or removing it from a jig or fixture, during the
inspection process. Ground the IC during assembly steps as an antistatic measure. Use similar precaution when transporting and storing the IC.
13/16
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