参数资料
型号: BD9850FVM-TR
厂商: Rohm Semiconductor
文件页数: 14/17页
文件大小: 0K
描述: IC REG CTRLR BUCK PWM 8-MSOP
标准包装: 1
PWM 型: 控制器
输出数: 1
频率 - 最大: 2MHz
电源电压: 4 V ~ 9 V
降压:
升压:
回扫:
反相:
倍增器:
除法器:
Cuk:
隔离:
工作温度: -40°C ~ 85°C
封装/外壳: 8-VSSOP,8-MSOP(0.110",2.80mm 宽)
包装: 标准包装
其它名称: BD9850FVM-DKR
BD9850FVM-DKR-ND
BD9850FVMDKR
8) IC pin input
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements to keep them isolated. Pin junctions are formed at the
intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example, the relation between each
potential is as follows:
When GND > Pin A and GND > Pin B, the Pin junction operates as a parasitic diode.
When Pin B > GND > Pin A, the P?N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits,
operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the
GND (P substrate) voltage to an input pin, should not be used.
Resistor
Transistor (NPN)
(Pin A)
(Pin B)
C
B
E
GND
N
P+
P
P+
P+
P
P+
N
N
N
Player
N
N
N
Player
Parasitic element
(Pin A)
GND
GND
Parasitic element
Parasitic element
(Pin B)
Other proximity element
B
GND
C
E
GND
Parasitic element
Fig. 28 Typical simple construction of monolithic IC
9) Common impedance
The power supply and ground lines must be as short and thick as possible to reduce line impedance. Fluctuating voltage
on the power ground
line may damage the device.
10) On the application shown below, Vcc is short-circuited to the Ground with external diode charged, internal circuits may be damaged.
recommended to insert a backflow prevention diode in series with the Vcc or a bypass diode between each pin and Vcc.
Bypass diode
Backflow prevention diode
Vcc
Output pin
Fig. 29
14/16
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