参数资料
| 型号： | BH31RB1WGUT-E2 |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 6/9页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3.1V .15A 4-VCSP |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3.1V |
| 输入电压： | 最高 5.5V |
| 电压 - 压降（标准）： | 0.1V @ 100mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 150mA（最小值） |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 4-WFBGA，CSPBGA |
| 供应商设备封装： | VCSP60N1 |
| 包装： | 标准包装 |
| 产品目录页面： | 1374 (CN2011-ZH PDF) |
| 其它名称： | BH31RB1WGUT-E2DKR |
BH □□ RB1WGUT series
Technical Note
● Output capacitors
Mounting input capacitor between input pin and GND (as close to pin as possible), and also output capacitor between output
pin and GND(as close to pin as possible) is recommended. The input capacitor reduces the output impedance of the voltage
supply source connected to the VCC. The higher value the output capacitor goes the more stable the whole operation
becomes. This leads to high load transient response. Please confirm the whole operation on actual application board.
Generally, ceramic capacitor has wide range of tolerance, temperature coefficient, and DC bias characteristic. And also its value
goes lower as time progresses. Please choose ceramic capacitors after obtaining more detailed data by asking capacitor makers.
BH RB1WGUT
100
C OUT = 1.0 μF
10
1
0.1
0.01
Stable region
Ta = +25°C
0
50
100
150
出力電流 I OUT [mA]
Output Current Iout [mA]
Fig. 29 Stable Operating Region Characteristics (Example)
● Operation Notes
1. Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as
fuses.
2. Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
3. Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
4. Thermal shutdown circuit (TSD)
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). The thermal shutdown circuit is designed only to shut
the IC off to prevent runaway thermal operation. It is not designed to protect the IC or guarantee its operation. Do not
continue to use the IC after operating this circuit or use the IC in an environment where the operation of this circuit is
assumed.
5. Overcurrent protection circuit
The IC incorporates a built-in overcurrent protection circuit that operates according to the output current capacity. This
circuit serves to protect the IC from damage when the load is shorted. The protection circuit is designed to limit current
flow by not latching in the event of a large and instantaneous current flow originating from a large capacitor or other
component. These protection circuits are effective in preventing damage due to sudden and unexpected accidents.
However, the IC should not be used in applications characterized by the continuous operation or transitioning of the
protection circuits. At the time of thermal designing, keep in mind that the current capability has negative characteristics to
temperatures.
6. Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
7. Ground wiring patterns
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the
GND wiring pattern of any external components, either.
8. Influence of strong light
Exposure of the IC to strong light sources such as infrared light from a halogen lamp may cause the IC to malfunction.
When it is necessary to use the IC in such environments, implement measures to block exposure to light from the light
source. During testing, exposure to neither fluorescent lighting nor white LEDs had a significant effect on the IC.
www.rohm.com
? 2011 ROHM Co., Ltd. All rights reserved.
6/8
2011.01 - Rev.C
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