参数资料
型号: BS616UV2019DCG85
厂商: BRILLIANCE SEMICONDUCTOR, INC.
英文描述: Hex Buffer/Driver With Open-Drain Outputs 14-SOIC -40 to 85
中文描述: 超低功率/电压CMOS SRAM的128K的× 16位
文件页数: 8/8页
文件大小: 255K
代理商: BS616UV2019DCG85
Revision 2.1
Jan.
2004
8
BS616LV1611
BSI
R0201-BS616LV1611
ORDERING INFORMATION
PACKAGE DIMENSIONS
E0
.1
3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.
N
E
D
NOTES:
48
12.0
9.0
E1
D1
e
3.75
5.25
0.75
SIDE VIEW
D0.1
D1
1.4
Max.
e
E1
0.2
5
±
0.0
5
SOLDER BALL 0.35±0.05
VIEW A
3.375
2.
625
48 mini-BGA (9mm x 12mm)
±
Note:
BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products
for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support
systems and critical medical instruments.
BS616LV1611 X X
Z
Y Y
GRADE
C: +0oC ~ +70oC
I: -40oC ~ +85oC
SPEED
55: 55ns
70: 70ns
PKG MATERIAL
-: Normal
G: Green
P: Pb free
PACKAGE
F :BGA-48-0912
相关PDF资料
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BS616UV2019DI Hex Buffer/Driver With Open-Drain Outputs 14-SOIC -40 to 85
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BS616UV2019DIP85 Ultra Low Power/Voltage CMOS SRAM 128K X 16 bit
BS616UV2019TC Hex Buffer/Driver With Open-Drain Outputs 14-SO -40 to 85
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