参数资料
型号: BU-61840B3-100S
厂商: DATA DEVICE CORP
元件分类: 微控制器/微处理器
英文描述: 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, PBGA128
封装: 0.815 X 0.815 INCH, 0.140 INCH HEIGHT, BGA-128
文件页数: 52/60页
文件大小: 763K
代理商: BU-61840B3-100S
56
Data Device Corporation
www.ddc-web.com
BU-6174X/6184X/6186X
D-03/02-250
1.00 SQ
±0.01
(25.40
±0.25)
72
1
VIEW "B"
Notes:
1) Dimensions are in inches (mm).
2) Package Material: Alumina (AL2O3)
3) Lead Material: Kovar, Plated by 50
in.
minimum nickel under 60
in. minimum gold.
4) There are 6 test pads located on the bottom of
the package. These pads are recessed so as
not to interfere when mounting the hybrid.
There are no user connections to these pads.
VIEW "B"
1.38
±0.02
(35.05
±0.51)
0.19
±0.01
(4.83
±0.25)
0.850
±0.008
(21.590
±0.203)
0.08 MIN FLAT
(2.03)
0.155 MAX
(3.94)
0.018
±0.002
(0.457
±0.051)
0.050
±0.005
(1.270
±0.127)
BOTTOM VIEW
SIDE VIEW
VIEW "A"
INDEX DENOTES
PIN NO. 1
P2
P1
P6
P5
P4
P3
0.100 DIA.
(2.540) (see note 4)
0.010
±0.002
(0.254
±0.051)
0.012 R. MAX
(0.305 R.)
0.05 MIN FLAT
(1.27)
1.024 ±0.014 NOM.
(26.010 ±0.356)
VIEW "A"
0.006 -0.004,+0.010
(0.152 -0.100,+ 0.254)
0.050 ±0.005
(1.27 ±0.127)
FIGURE 18. MECHANICAL OUTLINE DRAWING FOR 72-PIN GULL WING PACKAGE
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