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参数资料
| 型号： | BU-64840B3-E02 |
| 厂商： | DATA DEVICE CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, PBGA324 |
| 封装： | BGA-324 |
| 文件页数： | 3/4页 |
| 文件大小： | 683K |
| 代理商： | BU-64840B3-E02 |
Data Device Corporation
www.ddc-web.com
PARAMETER
MIN TYP
MAX UNITS
POWER SUPPLY REQUIREMENTS
Voltages/Tolerance
Logic/RAM +3.3V
3.0
3.3
3.6
V
Logic/RAM +5.0V
4.5
5.0
5.5
V
Transceivers +3.3V
3.15
3.3
3.45
V
Transceivers +5.0V
4.75
5.0
5.25
V
CURRENT DRAIN (Micro-ACE TE)
BU-64843B(R)8-E02, BU-65843B8-E02 (Note 1)
(add 15 mA for BU-64863B(R)8-E02,
BU-65863B8-E02)
+3.3V
0% Transmit/Monitor w/
transceiver SLEEPIN asserted
54
mA
0% Transmit/Monitor w/
transceiver SLEEPIN negated
95
mA
25% Duty Transmitter Cycle
315
mA
50% Duty Transmitter Cycle
535
mA
75% Duty Transmitter Cycle
755
mA
BU-64840B3-E02, BU-65843B3-E02
(add 20 mA to +5V for
BU-64860B(R)3-E02, 65864B3-E02) Note 4
+5V (Ch. A, Ch. B)
0% Transmit/Monitor
100
mA
25% Duty Transmitter Cycle
216
mA
50% Duty Transmitter Cycle
332
mA
75% Duty Transmitter Cycle
449
mA
+3.3V (Logic)
40
mA
CURRENT DRAIN ( Total Hybrid) (Micro-ACE )
BU-61740B(R)3, BU-61840B(r)3
(Operated with 3.3V logic power)
+5V (CH A, CH B)
0% Transmit/Monitor
65
100
mA
25% Duty Transmitter Cycle
180
216
mA
50% Duty Transmitter Cycle
295
332
mA
75% Duty Transmitter Cycle
410
449
mA
+3.3V (Logic)
25
40
mA
BU-61860B(R)3,
(Operated with 3.3V logic power)
+5V (CH A, CH B)
0% Transmit/Monitor
66
120
mA
25% Duty Transmitter Cycle
174
236
mA
50% Duty Transmitter Cycle
282
352
mA
75% Duty Transmitter Cycle
390
469
mA
+3.3V (Logic)
25
40
mA
POWER DISSIPATION (Micro-ACE TE)
(1553 Bus dissipation subtracted)
BU-64843B(R)8-E02, BU-65843B8-E02
(3.3V transceiver, Note 1 and 2)
(add .05W for BU-BU-64863B(R)8-E02,
BU-65863B8-E02)
0% Transmit/Monitor w/
transceiver SLEEPIN asserted
0.18
W
0% Transmit/Monitor w/
transceiver SLEEPIN negated
0.31
W
25% Duty Transmitter Cycle
0.71
W
50% Duty Transmitter Cycle
1.08
W
75% Duty Transmitter Cycle
1.46
W
BU-64840B3-E02, BU-65843B3-E02
(3.3V logic, 5V transceiver, add .1W
for BU-64860B(R)3-E02,BU-65864B(R)3-E02)
Note 2 and 4
0% Transmit/Monitor
0.63
W
PARAMETER
MIN TYP
MAX UNITS
POWER DISSIPATION (Micro-ACE TE) (continued)
25% Duty Transmitter Cycle
0.86
W
50% Duty Transmitter Cycle
1.09
W
75% Duty Transmitter Cycle
1.33
W
POWER DISSIPATION (Micro-ACE ) (See Note 5)
Total Hybrid
BU-61740B(R)3, BU-61840B(R)3
(Operated with 3.3V logic power)
0% Transmit/Monitor
0.41
0.63
W
25% Duty Transmitter Cycle
0.72
0.86
W
50% Duty Transmitter Cycle
0.97
1.09
W
75% Duty Transmitter Cycle
1.21
1.33
W
BU-61860B(R)3
(Operated with 3.3V logic power)
0% Transmit/Monitor
0.44
0.80
W
25% Duty Transmitter Cycle
0.80
1.09
W
50% Duty Transmitter Cycle
1.17
1.39
W
75% Duty Transmitter Cycle
1.53
1.68
W
Hottest Die (Transceiver chip)
0% Transmit/Monitor
0.18
0.28
W
25% Duty Transmitter Cycle
0.48
0.58
W
50% Duty Transmitter Cycle
0.78
0.88
W
75% Duty Transmitter Cycle
1.09
1.18
W
CLOCK INPUTS
PCI Clock Input: Frequency
(BU-658XXB3, BU-658XXB8 only)
Nominal Value
33
MHz
1553 Clock Input: Frequency
Default is 16 MHz (Programmable for
10, 12, 16 or 20 MHz)
10, 12,
16 or 20 MHz
THERMAL (Micro-ACE TE)
Thermal Resistance,
Junction-to-Ball, Hottest Die (0JB,)
Note 3
324 Ball BGA
15
°C/W
Operating Thermal Balls Temperature
-40
+100
°C
Operating Junction Temperature
-40
+150
°C
Storage Temperature
-65
+150
°C
Lead Temperature (soldering, 10 sec.)
+300
°C
THERMAL (Micro-ACE)
Thermal Resistance,
Junction-to-Ball, Hottest Die (0JB,)
18
22
Operating Thermal Balls Temperature
-40
+85
°C
Operating Junction Temperature
-55
+150
°C
Storage Temperature
-65
+150
°C
PHYSICAL CHARACTERISTICS
Package Body Size
324 ball BGA
0.815 X 0.815 X 0.120 Max (in.)
(20.7 x 20.7 x 3.05) Max (mm)
Weight
0.088 oz 2.5 (g)
MOISTURE SENSITIVITY LEVEL
MSL-3
Notes:
1. Current drain and power dissipation specs are based upon a small sampling of 3.3V transceivers and are subject to change.
2. Power dissipation is the input power minus the power delivered to the 1553 fault isolation resistors, the power delivered to the bus
termination resistors and the copper losses in the transceiver isolation transformer and the bus coupling transformer.
3. The thermal resistance numbers indicated are preliminary.
4. See Micro-ACE TE Data Sheet for current drain and power dissipation numbers for 5V only operation.
5. Power dissipation specifications assume a transformer coupled configuration with external dissipation (while transmitting) of 0.14 watts
for the active isolation transformer, 0.80 watts for the active bus coupling transformer, 0.45 watts for each of the two bus isolation resistors
and 0.15 watts for each of the two bus termination resistors.
BU-6474XB / BU-6484XB / 6486XB / 6584XB / 6586XB/61740B3/61840B3/61860B3
REV CODE 8
3
Specifications
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