参数资料
型号: BU1572GUW-E2
厂商: Rohm Semiconductor
文件页数: 2/9页
文件大小: 0K
描述: IC VID PROCESSER AIE RT 63VBGA
标准包装: 2,500
类型: 适应型图形增强器(AIE)
应用: 视频播放器
安装类型: 表面贴装
封装/外壳: 63-VFBGA
供应商设备封装: 63-VBGA
包装: 带卷 (TR)
1994 Fairchild Semiconductor Corporation
www.fairchildsemi.com
74LCX245
Lo
w
V
olta
g
e
Bidirectional
T
ransceiver
with
5V
T
olerant
Inputs
and
Outputs
Physical Dimensions (Continued)
Figure 8. 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specications do not expand the terms of Fairchild’s worldwide terms and conditions,
specically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
74LCX245 Rev. 1.11.1
13
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