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| 型号： | BU33TD3WG-TR |
| 厂商： | Rohm Semiconductor |
| 文件页数： | 8/13页 |
| 文件大小： | 0K |
| 描述： | IC REG LDO 3.3V .2A 5SSOP |
| 特色产品： | CMOS LDO Regulators |
| 标准包装： | 1 |
| 稳压器拓扑结构： | 正，固定式 |
| 输出电压： | 3.3V |
| 输入电压： | 最高 5.5V |
| 电压 - 压降（标准）： | 0.22V @ 200mA |
| 稳压器数量： | 1 |
| 电流 - 输出： | 200mA（最小值） |
| 电流 - 限制（最小）： | 220mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-TFSOP（0.063"，1.60mm 宽），5 引线 |
| 供应商设备封装： | 5-SSOP |
| 包装： | 标准包装 |
| 其它名称： | BU33TD3WG-DKR BU33TD3WG-DKR-ND BU33TD3WGDKR |
BUxxTD3WG series
Datasheet
About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the
original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability.
Therefore, be sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.) (VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
Measurement conditions
Standard ROHM Board
Layout of Board for
Measurement
Top Layer (Top View)
IC
Implementation
Position
Bottom Layer (Top View)
Measurement State
Board Material
Board Size
With board implemented (Wind speed 0 m/s)
Glass epoxy resin (Double-side board)
70 mm x 70 mm x 1.6 mm
Wiring
Rate
Top layer
Bottom
layer
Metal (GND) wiring rate: Approx. 0%
Metal (GND) wiring rate: Approx. 50%
0.6
Through Hole
Power Dissipation
Thermal Resistance
Diameter 0.5mm x 6 holes
0.54W
θ ja=185.2°C/W
0.5
0.4
0.54W
Standard ROHM
Board
0.3
* Please design the margin so that
0.2
PMAX becomes is than Pd (PMAX < Pd)
within the usage temperature range
0.1
0
0
25
50
75
85
100
125
Ta [ ℃ ]
Fig. 28 SSOP5 Power dissipation heat reduction characteristics (Reference)
www.rohm.com ? 2013 ROHM Co., Ltd. All rights reserved.
TSZ02201-0RBR0A300030-1-2
TSZ22111 ? 15 ? 001
8/10
21.AUG.2013.Rev.003
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