参数资料
型号: BUF20820AIDCPRE4
厂商: Texas Instruments
文件页数: 19/29页
文件大小: 0K
描述: IC 18CH PROG V-REF GEN 38-HTSSOP
标准包装: 2,000
应用: TFT-LCD 面板:伽玛缓冲器,VCOM 驱动器
输出类型: 满摆幅
电路数: 18
电流 - 电源: 18mA
电流 - 输出 / 通道: 100mA
电压 - 电源,单路/双路(±): 7 V ~ 18 V
安装类型: 表面贴装
封装/外壳: 38-TFSOP (0.173",4.40mm 宽)裸露焊盘
供应商设备封装: 38-HTSSOP
包装: 带卷 (TR)
BUF20820
SBOS330E DECEMBER 2005 REVISED OCTOBER 2008
www.ti.com
26
DIE
Side View (a)
End View (b)
Bottom View (c)
DIE
The thermal pad is electrically isolated from all terminals in the package.
Thermal
Pad
Figure 23. Views of Thermally-Enhanced DCP Package
For a given
qJA, the maximum power dissipation is shown
in Figure 24, and is calculated by Equation 3:
P
D
+
T
MAX
* T
A
q
JA
Where:
PD = maximum power dissipation (W)
TMAX = absolute maximum junction temperature (125
°C)
TA = free-ambient air temperature (
°C)
qJA = qJC + qCA
qJC = thermal coefficient from junction-to-case (°C/W)
qCA = thermal coefficient from case-to-ambient air (°C/W)
6
5
4
3
2
1
0
M
a
x
imum
P
ow
er
D
is
s
ipat
io
n
(W
)
40
20
0
100
40
60
80
20
T
A, FreeAir Temperature (_ C)
Figure 24. Maximum Power Dissipation vs
Free-Air Temperature
(with PowerPAD soldered down)
(3)
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