收藏本站
参数资料
型号： BX80547RE2667C
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 2600 MHz, MICROPROCESSOR, PBGA775
封装： FLIP CHIP, LGA-775
文件页数： 70/94页
文件大小： 2796K
代理商： BX80547RE2667C
72
Datasheet
Thermal Specifications and Design Considerations
Refer to the Intel Pentium 4 Processor on 90 nm Process in the 775-Land LGA Package
Thermal Design Guide and the Processor Power Characterization Methodology for the details of
this methodology.
The case temperature is defined at the geometric top center of the processor IHS. Analysis
indicates that real applications are unlikely to cause the processor to consume maximum power
dissipation for sustained periods of time. Intel recommends that complete thermal solution designs
target the Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor
power consumption. The Thermal Monitor feature is intended to help protect the processor in the
unlikely event that an application exceeds the TDP recommendation for a sustained period of time.
For more details on the usage of this feature, refer to Section 5.2. To ensure maximum flexibility
for future requirements, systems should be designed to the Platform Compatibility Guide ‘04 A
guidelines, even if a processor with a lower thermal dissipation is currently planned. In all cases,
the Thermal Monitor feature must be enabled for the processor to remain within
specification.
Table 5-1. Processor Thermal Specifications
Processor
Number
Processor Core
Frequency (GHz)
Thermal Design
Power (W)
Minimum TC
(°C)
Maximum TC (°C)
Notes
325J/326
2.53
84
5
See Table 5-2 and
Figure 5-1
1, 2
NOTES:
1.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maxi-
mum power that the processor can dissipate.
2.
This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. There-
fore, the maximum TC will vary depending on the TDP of the individual processor. Refer to thermal profile figure and
associated table for the allowed combinations of power and TC.
330J/331
2.66
84
5
See Table 5-2 and
Figure 5-1
1, 2
335J/336
2.80
84
5
See Table 5-2 and
Figure 5-1
1, 2
340J/341
2.93
84
5
See Table 5-2 and
Figure 5-1
1, 2
345J/346
3.06
84
5
See Table 5-2 and
Figure 5-1
1, 2
351
3.20
84
5
See Table 5-2 and
Figure 5-1
1, 2
355
3.33
84
5
See Table 5-2 and
Figure 5-1
1, 2
相关PDF资料
PDF描述
BX80547RE2933CN 32-BIT, 2930 MHz, MICROPROCESSOR, PBGA775
BX80551PG2800FN 32-BIT, 2800 MHz, MICROPROCESSOR, PBGA775
BX80551PG2800FT 32-BIT, 2800 MHz, MICROPROCESSOR, PBGA775
BX80552360 32-BIT, 3460 MHz, MICROPROCESSOR, CBGA775
BX80552651 32-BIT, 3400 MHz, MICROPROCESSOR, PBGA775
相关代理商/技术参数
参数描述
BX80547RE2667C S L7TM 制造商:Intel 功能描述:MPU CELERON D 90NM 2.66GHZ 775PIN FCLGA4 - Boxed Product (Development Kits)
BX80547RE2667CNS L98V 制造商:Intel 功能描述:
BX80547RE2800C S L7TN 制造商:Intel 功能描述:MPU CELERON D 90NM 2.8GHZ 775PIN FCLGA4 - Boxed Product (Development Kits)
BX80547RE2800CNS L98W 制造商:Intel 功能描述:MPU Celeron? D Processor 336 90nm 2.8GHz 775-Pin FCLGA4
BX80547RE2933C S L7TP 制造商:Intel 功能描述: 制造商:Intel 功能描述:MPU CELERON D 90NM 2.93GHZ 775PIN FCLGA4 - Boxed Product (Development Kits)
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*