- 您现在的位置：买卖IC网 > PDF目录298892 > BX80547RE3066CN (INTEL CORP) 32-BIT, 3060 MHz, MICROPROCESSOR, PBGA775 PDF资料下载
参数资料
| 型号： | BX80547RE3066CN |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3060 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 27/94页 |
| 文件大小： | 2796K |
| 代理商： | BX80547RE3066CN |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页当前第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页
Datasheet
33
Package Mechanical Specifications
3
Package Mechanical
Specifications
The Celeron D processor in the 775-land package is packaged in a Flip-Chip Land Grid Array
(FC-LGA4) package that interfaces with the motherboard via an LGA775 socket. The package
consists of a processor core mounted on a substrate land-carrier. An integrated heat spreader (IHS)
is attached to the package substrate and core and serves as the mating surface for processor
component thermal solutions, such as a heatsink. Figure 3-1 shows a sketch of the processor
package components and how they are assembled together. Refer to the LGA775 Socket
Mechanical Design Guide for complete details on the LGA775 socket.
The package components shown in Figure 3-1 include the following:
Integrated Heat Spreader (IHS)
Thermal Interface Material (TIM)
Processor core (die)
Package substrate
Capacitors
NOTE:
1. Socket and motherboard are included for reference and are not part of processor package.
3.1
Package Mechanical Drawing
The package mechanical drawings are shown in Figure 3-2 through Figure 3-4. The drawings
include dimensions necessary to design a thermal solution for the processor. These dimensions
include:
Package reference with tolerances (total height, length, width, etc.)
IHS parallelism and tilt
Land dimensions
Top-side and back-side component keep-out dimensions
Reference datums
All drawing dimensions are in mm [in].
Figure 3-1. Processor Package Assembly Sketch
System Board
LGA775 Socket
Capacitors
TIM
Core (die)
IHS
Substrate
相关PDF资料 |
PDF描述 |
|---|---|
| B80547RE061256 | 32-BIT, 2530 MHz, MICROPROCESSOR, PBGA775 |
| B80547RE077256 | 32-BIT, 2930 MHz, MICROPROCESSOR, PBGA775 |
| BX80547RE2933C | 32-BIT, 2930 MHz, MICROPROCESSOR, PBGA775 |
| BX80547RE3330CN | 32-BIT, 3330 MHz, MICROPROCESSOR, CBGA775 |
| BX80547RE2533C | 32-BIT, 2530 MHz, MICROPROCESSOR, PBGA775 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| BX805499010 | 制造商:Intel 功能描述:ITANIUM 1.60 GHZ - Boxed Product (Development Kits) |
| BX805499015 | 制造商:Intel 功能描述:DUAL-CORE ITANIUM 1.40 GHZ - Boxed Product (Development Kits) |
| BX805499020 | 制造商:Intel 功能描述:DUAL-CORE ITANIUM 1.42 GHZ - Boxed Product (Development Kits) |
| BX805499030 | 制造商:Intel 功能描述:DUAL-CORE ITANIUM 1.60 GHZ - Boxed Product (Development Kits) |
| BX805499040 | 制造商:Intel 功能描述:DUAL-CORE ITANIUM 1.60 GHZ - Boxed Product (Development Kits) |
发布紧急采购，3分钟左右您将得到回复。