- 您现在的位置：买卖IC网 > PDF目录298892 > BX80547RE3066CN (INTEL CORP) 32-BIT, 3060 MHz, MICROPROCESSOR, PBGA775 PDF资料下载
参数资料
| 型号： | BX80547RE3066CN |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3060 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 87/94页 |
| 文件大小： | 2796K |
| 代理商： | BX80547RE3066CN |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页当前第87页第88页第89页第90页第91页第92页第93页第94页
88
Datasheet
Boxed Processor Specifications
7.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the boxed
processor.
7.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's
temperature specification is also a function of the thermal design of the entire system, and
ultimately the responsibility of the system integrator. For the processor temperature specification,
refer to Chapter 5. The boxed processor fan heatsink is able to keep the processor temperature
within the specifications listed in Table 5-1 for chassis that provide good thermal management. For
the boxed processor fan heatsink to operate properly, it is critical that the airflow provided to the
fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the
fan heatsink. Airspace is required around the fan to ensure that the airflow through the fan heatsink
is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and
decreases fan life. Figure 7-7 and Figure 7-8 illustrate an acceptable airspace clearance for the fan
heatsink. The air temperature entering the fan should be kept below 38 °C. Again, meeting the
processor's temperature specification is the responsibility of the system integrator.
相关PDF资料 |
PDF描述 |
|---|---|
| B80547RE061256 | 32-BIT, 2530 MHz, MICROPROCESSOR, PBGA775 |
| B80547RE077256 | 32-BIT, 2930 MHz, MICROPROCESSOR, PBGA775 |
| BX80547RE2933C | 32-BIT, 2930 MHz, MICROPROCESSOR, PBGA775 |
| BX80547RE3330CN | 32-BIT, 3330 MHz, MICROPROCESSOR, CBGA775 |
| BX80547RE2533C | 32-BIT, 2530 MHz, MICROPROCESSOR, PBGA775 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| BX805499010 | 制造商:Intel 功能描述:ITANIUM 1.60 GHZ - Boxed Product (Development Kits) |
| BX805499015 | 制造商:Intel 功能描述:DUAL-CORE ITANIUM 1.40 GHZ - Boxed Product (Development Kits) |
| BX805499020 | 制造商:Intel 功能描述:DUAL-CORE ITANIUM 1.42 GHZ - Boxed Product (Development Kits) |
| BX805499030 | 制造商:Intel 功能描述:DUAL-CORE ITANIUM 1.60 GHZ - Boxed Product (Development Kits) |
| BX805499040 | 制造商:Intel 功能描述:DUAL-CORE ITANIUM 1.60 GHZ - Boxed Product (Development Kits) |
发布紧急采购，3分钟左右您将得到回复。