参数资料
型号: BX80552651T2
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 3400 MHz, MICROPROCESSOR, PBGA775
封装: FLIP CHIP, LGA-775
文件页数: 54/108页
文件大小: 3283K
代理商: BX80552651T2
Datasheet
5
Contents
Figures
2-1 VCC Static and Transient Tolerance for 775_VR_CONFIG_05A Processors.............................25
2-2 VCC Overshoot Example Waveform ...........................................................................................26
6-1 Processor Low Power State Machine......................................................................................... 90
7-1 Mechanical Representation of the Boxed Processor.................................................................. 93
7-2 Space Requirements for the Boxed Processor (Side View; applies to all four side views) ........ 94
7-3 Space Requirements for the Boxed Processor (Top View) ........................................................ 94
7-5 Boxed Processor Fan Heatsink Power Cable Connector Description ........................................ 96
7-6 Baseboard Power Header Placement Relative to Processor Socket ......................................... 97
7-7 Boxed Processor Fan Heatsink Airspace Keep-out Requirements
(Side 1 View) .............................................................................................................................. 98
7-8 Boxed Processor Fan Heatsink Airspace Keep-out Requirements
(Side 2 View) .............................................................................................................................. 98
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