参数资料
型号: C1608C0G1H1R2C
厂商: TDK Corporation
文件页数: 63/72页
文件大小: 0K
描述: CAP CER 1.2PF 50V NP0 0603
产品目录绘图: C SERIES_0603_0.95
特色产品: C-Series Mid Voltage MLCCs
标准包装: 1
系列: C
电容: 1.2pF
电压 - 额定: 50V
容差: ±0.25pF
温度系数: C0G,NP0
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 125°C
应用: 通用
封装/外壳: 0603(1608 公制)
尺寸/尺寸: 0.063" L x 0.031" W(1.60mm x 0.80mm)
厚度(最大): 0.037"(0.95mm)
包装: 标准包装
产品目录页面: 2179 (CN2011-ZH PDF)
其它名称: 445-5011-6
General
Specifications
C Series – General Application
No.
7
8
Item
Temperature
Characteristics
of Capacitance
(Class 1)
Temperature
Characteristics
of Capacitance
(Class 2)
Performance
T.C. Temperature Coefficient
C0G 0 ± 30 (ppm/oC)
Capacitance drift
Within ± 0.2% or ± 0.05pF, whichever
larger.
Capacitance Change (%)
No Voltage Applied
X5R: ± 15%
X7R: ± 15%
X6S: ± 22%
X7S: ± 22%
X7T: +22/-33%
Y5V: + 22/-82%
Test or Inspection Method
Temperature coefficient shall be calculated based on
values at 25oC and 85oC temperature.
Measuring temperature below 20oC shall be -10oC and
-25oC.
Capacitance shall be measured by the steps shown in
the following table after thermal equilibrium is obtained
for each step.
? C be calculated ref. STEP 3 reading
Step Temperature (oC)
1 Reference temp. ± 2
2 Min. operating temp. ± 2
3 Reference temp. ± 2
4
Max. operating temp. ± 2
Measuring voltage: 0.1, 0.2, 0.5, 1.0V rms .
9
Robustness of
Terminations
No sign of termination coming off,
breakage of ceramic, or other abnormal
signs.
Reflow solder the capacitor on P.C. board (shown in
Appendix 1a or Appendix 1b) and apply a pushing
force of 2N (C0603, C1005) or 5N (C1608, C2012,
C3216, C3225, C4532, C5750) for 10 ± 1s.
Pushing force
Capacitor
P.C. board
10
Bending
No mechanical damage.
Reflow solder the capacitor on P.C. board (shown in
Appendix 2a or Appendix 2b) and bend it for 1mm.
20
50
F
R230
1
45
45
Unit: mm
TDK MLCC US Catalog
Page 65
Version B11
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C1608C0G1H200J CAP CER 20PF 50V 5% NP0 0603
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相关代理商/技术参数
参数描述
C1608C0G1H1R2C/10 制造商:TDK CORPORATION OF AMERICA 功能描述:Size: 0603, T.C: C0G, Voltage: 50, Cap Value: 1.2, Tol: +/-0.25pF
C1608C0G1H1R3B 功能描述:多层陶瓷电容器MLCC - SMD/SMT RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
C1608C0G1H1R3C 功能描述:多层陶瓷电容器MLCC - SMD/SMT RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
C1608C0G1H1R5B 功能描述:多层陶瓷电容器MLCC - SMD/SMT 0603 50volts 1.5pF C0G 0.10pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
C1608C0G1H1R5B/10 制造商:TDK CORPORATION OF AMERICA 功能描述:Size: 0603, T.C: C0G, Voltage: 50, Cap Value: 1.5, Tol: +/-0.10pF