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参数资料
| 型号： | C2012X7R1H474M/SOFT |
| 厂商： | TDK Corporation |
| 文件页数： | 14/16页 |
| 文件大小： | 0K |
| 描述： | CAP CER 0.47UF 50V 20% X7R 0805 |
| 特色产品： | C-Series Mid Voltage MLCCs Soft Termination MLCC |
| 标准包装： | 1 |
| 系列： | C |
| 电容： | 0.47µF |
| 电压 - 额定： | 50V |
| 容差： | ±20% |
| 温度系数： | X7R |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | Boardflex 敏感 |
| 封装/外壳： | 0805（2012 公制） |
| 尺寸/尺寸： | 0.079" L x 0.049" W（2.00mm x 1.25mm） |
| 厚度（最大）： | 0.057"（1.45mm） |
| 特点： | 软端子 |
| 包装： | 标准包装 |
| 其它名称： | 445-6800-6 |
Soldering
Information
? Recommended Soldering Land Pattern
CSeries–SoftTerminationType
? Recommended Soldering Profile
Soldering Natural
Temp
Temp
C
Chip capacitor
Solder land
Peak
Wave Soldering
Soldering
Preheating
Natural
cooling
Peak
Reflow Soldering
Preheating cooling
T
? T
B
A
Solder resist
Wave Soldering
Type C2012
Symbol [CC0805]
A 1.0 - 1.3
B 1.0 - 1.2
C 0.8 - 1.1
Reflow Soldering
Unit: mm
C3216
[CC1206]
2.1 - 2.5
1.1 - 1.3
1.0 - 1.3
Unit: mm
0
300
Over 60 sec. Over 60 sec.
Peak Temp time
Manual soldering
(Solder iron)
? T
0
Over 60 sec.
Peak Temp time
APPLICATION
For C2012 (CC0805) and
C3216 (CC1206), applied
wave soldering and reflow
soldering.
Symbol
A
B
C
Type
C2012
[CC0805]
0.9 - 1.2
0.7 - 0.9
0.9 - 1.2
C3216
[CC1206]
2.0 - 2.4
1.0 - 1.2
1.1 - 1.6
0
Preheating
3sec. (As short as possible)
For C3225 (CC1210), C4532
(CC1812), C5750 (CC2220),
applied only reflow soldering.
250 max.
3 max.
260 max.
5 max.
Reflow Soldering
Type C3225
Symbol [CC1210]
A 2.0 - 2.4
B 1.0 - 1.2
C 1.9 - 2.5
C4532
[CC1812]
3.1 - 3.7
1.2 - 1.4
2.4 - 3.2
Unit: mm
C5750
[CC2220]
4.1 - 4.8
1.2 - 1.4
4.0 - 5.0
Recommended soldering duration
Temp./ Wave Soldering
Dura. Peak temp Duration
Solder ( ° C) (sec.)
Sn-Pb
Solder
Lead-Free
Solder
Reflow Soldering
Peak temp Duration
( ° C) (sec.)
230 max. 20 max.
260 max. 10 max.
? Recommended Solder Amount
Recommended solder compositions
Excessive
solder
Higher tensile
force on the chip
capacitor may
cause cracking.
Sn-37Pb (Sn-Pb solder)
Sn-3.0Ag-0.5Cu (Lead Free Solder)
Preheating Condition
Adequate
solder
Insufficient
solder
TDK MLCC US Catalog
Maximum amoun t
Minimum amount
Small solder fillet
may cause
contact failure or
failure to hold the
chip capacitor to
the P.C. board.
Soldering
Wave
soldering
Reflow
soldering
Manual
soldering
Page 176
Case Size - JIS (EIA)
C2012(CC0805), C3216(CC1206)
C2012(CC0805), C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
C2012(CC0805), C3216(CC1206)
C3225(CC1210), C4532(CC1812),
C5750(CC2220)
Temp. (oC)
? T ≤ 150
? T ≤ 150
? T ≤ 130
? T ≤ 150
? T ≤ 130
Version B11
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相关代理商/技术参数 |
参数描述 |
|---|---|
| C2012X7R1H682JT | 制造商:TDK 功能描述:C2012X7R1H682JT |
| C2012X7R1H682K | 制造商:TDK 功能描述: |
| C2012X7R1H682KT | 制造商:TDK Epcos 功能描述: |
| C2012X7R1H683KT | 制造商:TDK Epcos 功能描述: |
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