参数资料
型号: C2012X8R1E224K
厂商: TDK Corporation
文件页数: 16/16页
文件大小: 0K
描述: CAP CER 0.22UF 25V 10% X8R 0805
产品培训模块: High Capacitance Replacement
产品目录绘图: C SERIES_0805_1.45
特色产品: C-Series Mid Voltage MLCCs
标准包装: 1
系列: C
电容: 0.22µF
电压 - 额定: 25V
容差: ±10%
温度系数: X8R
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 150°C
应用: 通用
封装/外壳: 0805(2012 公制)
尺寸/尺寸: 0.079" L x 0.049" W(2.00mm x 1.25mm)
厚度(最大): 0.057"(1.45mm)
特点: 高温
包装: 标准包装
产品目录页面: 2183 (CN2011-ZH PDF)
其它名称: 445-2512-6
Additional
Information
? Shape & Dimensions
CSeries–HighTemperatureApplication
? Environmental Information
B
L
G
B
Terminal electrode
W
TDK Corporation established internal product environmental
assurance standards that include the six hazardous substances
banned by the EU RoHS Directive 1 enforced on July 1, 2006
along with additional substances independently banned by TDK
and has successfully completed making general purpose
electronic components conform to the RoHS Directive 2 .
C2012
CC0805
2.00
1.20
0.20 min.
T
Internal electrode
Ceramic dielectric
Case Code Dimensions (mm)
JIS EIA L W T B
C1005 CC0402 1.00 0.50 0.50 0.25
C1608 CC0603 1.60 0.80 0.80 0.20 min.
0.85
1.25
0.85
G
0.35 min.
0.30 min.
0.50 min.
1.
2.
Abbreviation for Restriction on Hazardous Substances,
which refers to the regulation EU Directive 2002/95/EC on
hazardous substances by the European Union (EU)
effective from July 1, 2006. The Directive bans the use of
six specific hazardous substances in electric and
electronic devices and products handled within the EU.
The six substances are lead, mercury, cadmium,
hexavalent chromium, PBB (polybrominated biphenyls),
and PBDE (polybrominated diphenyl ethers).
This means that, in conformity with the EU Directive
2002/95/EC, lead, cadmium, mercury, hexavalent
chromium, and specific bromine-based flame retardants,
PBB and PBDE, have not been used, except for
exempted applications.
C3216 CC1206 3.20 1.60
C3225 CC1210 3.20 2.50
? Inside Structure & Material System
1.15
1.60
1.60
2.00
2.50
0.20 min.
0.20 min.
1.00 min.
1.00 min
For REACH (SVHC : 15 substances according to ECHA /
October 2008) : All TDK MLCC do not contain these 15
substances.
For European Directive 2000/53/CE and 2005/673/CE :
Cadmium, Hexavalent Chromium, Mercury, Lead are not
contained in all TDK MLCC.
For European Directive 2003/11/CE : Pentabromodiphenyl-ether,
Octabromodiphenyl-ether are not contained in all TDK
MLCC.
3
4
5
1
2
No.
NAME
MATERIAL
Class 1
Class 2
(1)
Ceramic Dielectric
CaZrO 3
BaTiO 3
(2)
(3)
(4)
(5)
Internal Electrode
Termination
Nickel (Ni)
Copper (Cu)
Nickel (Ni)
Tin (Sn)
TDK MLCC US Catalog
Page 132
Version B11
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相关代理商/技术参数
参数描述
C2012X8R1E224K/10 制造商:TDK CORPORATION OF AMERICA 功能描述:Size: 0805, T.C: X8R, Voltage: 25, Cap Value: 220000, Tol: +/-10%
C2012X8R1E224K125AA 制造商:TDK 功能描述:CAP .22UF 25VDC X8R 10% SMD 0805 - Tape and Reel 制造商:TDK 功能描述:CAP CER 0.22UF 25V 10% X8R 0805 制造商:TDK 功能描述:CAPACITOR CERAMIC 0.22UF, 25V, X8R, 10%, 0805; Capacitance:0.22F; Capacitance Tolerance: 10%; Dielectric Characteristic:X8R; Voltage Rating:25V; Capacitor Case Style:0805 [2012 Metric]; Capacitor Terminals:SMD; No. of Pins:2 ;RoHS Compliant: Yes 制造商:TDK CORPORATION OF AMERICA 功能描述:Case:C2012, T.C:X8R, Voltage:1E, Cap Value:224, Tol:K, Thickness:1.25, E series: 3
C2012X8R1E224K125AE 功能描述:0.22μF 25V 陶瓷电容器 X8R 0805(2012 公制) 0.079" 长 x 0.049" 宽(2.00mm x 1.25mm) 制造商:tdk corporation 系列:C 包装:剪切带(CT) 零件状态:有效 电容:0.22μF 容差:±10% 电压 - 额定:25V 温度系数:X8R 安装类型:表面贴装,MLCC 工作温度:-55°C ~ 150°C 应用:Boardflex 敏感 等级:- 封装/外壳:0805(2012 公制) 大小/尺寸:0.079" 长 x 0.049" 宽(2.00mm x 1.25mm) 高度 - 安装(最大值):- 厚度(最大值):0.059"(1.50mm) 引线间距:- 特性:软端子 引线形式:- 标准包装:1
C2012X8R1E224M125AA 功能描述:0.22μF 25V 陶瓷电容器 X8R 0805(2012 公制) 0.079" 长 x 0.049" 宽(2.00mm x 1.25mm) 制造商:tdk corporation 系列:C 包装:剪切带(CT) 零件状态:有效 电容:0.22μF 容差:±20% 电压 - 额定:25V 温度系数:X8R 安装类型:表面贴装,MLCC 工作温度:-55°C ~ 150°C 应用:通用 等级:- 封装/外壳:0805(2012 公制) 大小/尺寸:0.079" 长 x 0.049" 宽(2.00mm x 1.25mm) 高度 - 安装(最大值):- 厚度(最大值):0.057"(1.45mm) 引线间距:- 特性:高温 引线形式:- 标准包装:1
C2012X8R1E224M125AE 功能描述:0.22μF 25V 陶瓷电容器 X8R 0805(2012 公制) 0.079" 长 x 0.049" 宽(2.00mm x 1.25mm) 制造商:tdk corporation 系列:C 包装:带卷(TR) 零件状态:有效 电容:0.22μF 容差:±20% 电压 - 额定:25V 温度系数:X8R 安装类型:表面贴装,MLCC 工作温度:-55°C ~ 150°C 应用:Boardflex 敏感 等级:- 封装/外壳:0805(2012 公制) 大小/尺寸:0.079" 长 x 0.049" 宽(2.00mm x 1.25mm) 高度 - 安装(最大值):- 厚度(最大值):0.059"(1.50mm) 引线间距:- 特性:软端子 引线形式:- 标准包装:2,000