参数资料
型号: CAT24C256ZD2IGT2
厂商: ON Semiconductor
文件页数: 1/18页
文件大小: 0K
描述: IC EEPROM I2C SRL 256KB 8TDFN
产品变化通告: 1Q2012 Discontinuation 30/Mar/2012
标准包装: 2,000
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 256K (32K x 8)
速度: 400kHz
接口: I²C,2 线串口
电源电压: 1.8 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-WFDFN 裸露焊盘
供应商设备封装: 8-TDFN(2x3)
包装: 带卷 (TR)
CAT24C256
256 kb I 2 C CMOS Serial
EEPROM
Description
The CAT24C256 is a 256 kb Serial CMOS EEPROM, internally
organized as 32,768 words of 8 bits each.
It features a 64 ? byte page write buffer and supports the Standard
(100 kHz), Fast (400 kHz) and Fast ? Plus (1 MHz) I 2 C protocol.
http://onsemi.com
Write operations can be inhibited by taking the WP pin High (this
protects the entire memory).
External address pins make it possible to address up to eight
CAT24C256 devices on the same bus.
On ? Chip ECC (Error Correction Code) makes the device suitable
for high reliability applications.*
TDFN ? 8**
ZD2 SUFFIX
CASE 511AM
TSSOP ? 8
SOIC ? 8
X SUFFIX
CASE 751BE
SOIC ? 8
W SUFFIX
CASE 751BD
UDFN ? 8
A 0
V CC
Features
? Supports Standard, Fast and Fast ? Plus I 2 C Protocol
? 1.8 V to 5.5 V Supply Voltage Range
? 64 ? Byte Page Write Buffer
? Hardware Write Protection for Entire Memory
? Schmitt Triggers and Noise Suppression Filters on I 2 C Bus Inputs
(SCL and SDA)
? Low Power CMOS Technology
? 1,000,000 Program/Erase Cycles
? 100 Year Data Retention
? Industrial and Extended Temperature Range
? PDIP, SOIC, TSSOP, MSOP 8 ? Lead and
TDFN, UDFN 8 ? Pad Packages
? This Device is Pb ? Free, Halogen Free/BFR Free, and RoHS
Compliant
V CC
Y SUFFIX
CASE 948AL
HU4 SUFFIX
CASE 517AZ
PDIP ? 8 MSOP ? 8
L SUFFIX Z SUFFIX
CASE 646AA CASE 846AD
PIN CONFIGURATION
1
A 1 WP
A 2 SCL
V SS SDA
PDIP (L), SOIC (W, X), TSSOP (Y),
TDFN (ZD2)**, UDFN (HU4), MSOP (Z)
For the location of Pin 1, please consult the
corresponding package drawing.
** Not recommended for new designs
SCL
Pin Name ?
PIN FUNCTION
Function
A 2 , A 1 , A 0
WP
CAT24C256
SDA
A 0 , A 1 , A 2
SDA
Device Address
Serial Data
SCL
WP
Serial Clock
Write Protect
V SS
Figure 1. Functional Symbol
V CC
V SS
Power Supply
Ground
* Available for New Product (Rev. E)
?The exposed pad for the TDFN/UDFN packages can
be left floating or connected to Ground.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 18 of this data sheet.
? Semiconductor Components Industries, LLC, 2014
January, 2014 ? Rev. 14
1
Publication Order Number:
CAT24C256/D
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