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| 型号： | CAT3200TDI-TE7 |
| 厂商： | ON Semiconductor |
| 文件页数： | 8/12页 |
| 文件大小： | 0K |
| 描述： | IC REG BST SWITCHED CAP TSOT23-6 |
| 标准包装： | 1 |
| 类型： | 升压（升压），切换电容（充电泵） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 2.7 V ~ 6 V |
| 输入电压： | 2.7 V ~ 4.5 V |
| 频率 - 开关： | 2MHz |
| 电流 - 输出： | 100mA |
| 同步整流器： | 无 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 细型，TSOT-23-6 |
| 包装： | 标准包装 |
| 供应商设备封装： | TSOT-23-6 |
| 其它名称： | CAT3200TDI-TE7DKR |
CAT3200, CAT3200 ? 5
Application Information
Ceramic Capacitors
Ceramic capacitors of different dielectric materials lose
their capacitance with higher temperature and voltage at
different rates. For example, a capacitor made of X5R or
X7R material will retain most of its capacitance from – 40 ° C
to 85 ° C whereas a Z5U or Y5V style capacitor will lose
considerable capacitance over that range.
Z5U and Y5V capacitors may also have voltage
coefficient causing them to lose 60% or more of their
capacitance when the rated voltage is applied. When
comparing different capacitors it is often useful consider the
amount of achievable capacitance for a given case size rather
than discussing the specified capacitance value. For
example, over rated voltage and temperature conditions, a
1 m F, 10 V, Y5V ceramic capacitor in an 0603 case may not
provide any more capacitance than a 0.22 m F, 10 V, X7R
available in the same 0603 case. For many CAT3200/
CAT3200 ? 5 applications these capacitors can be considered
roughly equivalent.
The capacitor manufacturer ’s data sheet should be
consulted to determine what value of capacitor is needed to
ensure the desired capacitance at all temperatures and
voltages. Below is a list of ceramic capacitor
manufacturers and how to contact them:
Table 5. CERAMIC CAPACITOR MANUFACTURERS
Capacitor
Manufacturer Web Phone
Murata www.murata.com 814.237.1431
AVX/Kemet www.avxcorp.com 843.448.9411
Vishay www.vishay.com
Thermal Management
For higher input voltages and maximum output current
there can be substantial power dissipation in the CAT3200/
CAT3200 ? 5. If the junction temperature increases to 160 ° C,
the thermal shutdown circuitry will automatically turn off
the output.
A good thermal connection to the PC board is
recommended to reduce the chip temperature. Connecting
the GND pin (Pins 4/5 for CAT3200, Pin 2 for CAT3200 ? 5)
to a ground plane, and maintaining a solid ground plane
under the device reduces the overall thermal resistance.
The overall junction to ambient thermal resistance ( q JA )
for device power dissipation (P D ) consists primarily of two
paths in series. The first path is the junction to the case ( q JC )
which is defined by the package style, and the second path
is case to ambient ( q CA ) thermal resistance which is
dependent on board layout. The final operating junction
temperature for any set of conditions can be estimated by the
following thermal equation:
T JUNC = T AMB + P D ( Q JC ) + P D ( Q CA )
T JUNC = T AMB + P D ( Q JA )
The CAT3200 in SOT23 package, when mounted on
printed circuit board with two square inches of copper
allocated for “heat spreading”, will result with an overall θ JA
of less than 150 ° C/W.
For a typical application operating from a 3.8 V input
supply, the maximum power dissipation is 260 mW
(100 mA x 3 V). This would result if a maximum junction
temperature of:
T JUNC = T AMB + P D ( q JA )
T JUNC = 85 ° C + 0.26 W (150 ° C/W)
T JUNC = 85 ° C + 39 ° C = 124 ° C
The use of multi ? layer board construction with power
Kemet
Taiyo Yuden
www.kemet.com
www.t ? yuden.com
408.986.0424
408.573.4150
planes will further enhance the overall thermal performance.
In the event of no dedicated copper area being used for heat
spreading, a multi ? layer board will typically provide the
CAT3200 with an overall q JA of 200 ° C/W. This level of
thermal conduction would allow up to 200 mW be safely
dissipated within the device.
http://onsemi.com
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