参数资料
型号: CBC-EVAL-05
厂商: Cymbet Corporation
文件页数: 14/16页
文件大小: 0K
描述: ENERCHIP CC EVAL KIT
产品培训模块: Energy Processing and Solid State Batteries for Energy Harvesting
特色产品: EnerChip? CC Evaluation Kit
标准包装: 1
系列: EnerChip™ CC
主要目的: 电源管理,电池充电器
嵌入式:
已用 IC / 零件: CBC3112,CBC3150
主要属性: 薄膜充电式固态电池
次要属性: 12 µAh 和 50 µAh 容量电池
已供物品:
相关产品: 859-1010-6-ND - IC BATT SOLID ST ENERCHIP 20DFN
859-1008-6-ND - IC BATT SOLID ST ENERCHIP 20DFN
859-1010-1-ND - IC BATT SOLID ST ENERCHIP 20DFN
859-1008-1-ND - IC BATT SOLID ST ENERCHIP 20DFN
CBC3150-D9C-TR5-ND - IC BATT SOLID ST ENERCHIP 20DFN
859-1008-2-ND - IC BATT SOLID ST ENERCHIP 20DFN
CBC3112-D7C-TR5-ND - IC BATT SOLID ST ENERCHIP 20DFN
859-1010-2-ND - IC BATT SOLID ST ENERCHIP 20DFN
859-1007-5-ND - IC BATT SOLID ST ENERCHIP 20DFN
其它名称: 859-1001
EnerChip CC CBC3112
EnerChip CC CBC3112 PCB Layout Guidelines - Important Notice!
There are several PCB layout considerations that must be taken into account when using the CBC3112:
1. All capacitors should be placed as close as possible to the EnerChip CC. The flying capacitor connections
must be as short as possible and routed on the same layer the EnerChip CC is placed.
2. Power connections should be routed on the layer the EnerChip CC is placed.
3. A ground (GND) plane in the PCB should be used for optimal performance of the EnerChip CC.
4. Very low parasitic leakage currents from the V BAT pin to power, signal, and ground connections, can result
in unexpected drain of charge from the integrated power source. Maintain sufficient spacing of traces and
vias from the V BAT pin and any traces connected to the V BAT pin in order to eliminate parasitic leakage
currents that can arise from solder flux or contaminants on the PCB.
5. Pin 1 V BAT and Pin 4 V CHG must be tied together for proper operation.
6. There should be no traces, vias or connections under the CBC3112 exposed die pad.
7. When placing a silk screen on the PCB around the perimeter of the package, place the silk screen outside
of the package and all metal pads. Failure to observe this precaution can result in package cracking during
solder reflow due to the silk screen material interfering with the solder solidification process during cooling.
8. See Figure 12 for location and dimensions of metal pad placement on the PCB.
Important Note: Designers using EnerChips in their products should also download the EnerChip User Manual
Application Note AN-1026 found here: http://www.cymbet.com/products/datasheets-downloads.php.
Figure 12: Recommend PCB Layout for the CBC3112-D7C Package (Dimensions in mm)
Cymbet Logo
Lot Number
Part Number
Date Code
CBC3112
Labeling
Information
Placement
DS-72-04 Rev F
?2009-2013 Cymbet Corporation ? Tel: +1-763-633-1780 ? www.cymbet.com
Page 14 of 16
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