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参数资料
| 型号： | CHF5225CBF500L |
| 厂商： | BOURNS INC |
| 元件分类： | 衰减器 |
| 英文描述： | 60 W Power RF Flanged Chip Termination |
| 中文描述： | 0 MHz - 4000 MHz 50 ohm RF/MICROWAVE TERMINATION |
| 封装： | ROHS COMPLIANT, FM-1 |
| 文件页数： | 1/1页 |
| 文件大小： | 184K |
| 代理商： | CHF5225CBF500L |
COPYRIGHT 2005, BOURNS, INC. LITHO IN U.S.A., SR0502 12/05
CHF5225CBF Series 60 W Power RF Flanged Chip Termination
Features
■
DC to 4 GHz
■
Flanged model
■
Low VSWR
Applications
■
High power RF transmission
General Specifications
Substrate...........................................Beo
Resistive Film...........................Thick Film
Tab.......................................................Ag
Cover Substrate.............................AL203
Mounting Flange ..........Cu plated with Ni
Resistance........................................50
Tolerance.........................................±5 %
Packaging...........................100 pcs./tray
Absolute Ratings
Power...............................................60 W
Frequency...................................4.0 GHz
VSWR.................................1.2 Maximum
P
Heat Sink Temperature (
°
C)
70
60
50
40
30
20
10
0
-55
0
100
150
Characteristic Curve
How To Order
CHF 5225 C B F 500 L
Model
Size
Version
Substrate
Mount
F = Flange
Value
500 = 50 Ohm
Function
L = Termination
Reliable Electronic Solutions
Asia-Pacific:
Tel: +886-2 2562-4117
Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555
Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500
Fax: +1-951 781-5700
www.bourns.com
Product Dimensions
0.1
(.004)
Version C
Version D
Version E
4.0
(.157)
2.57
(.101)
3.0
(.118)
DIA.
DIA.
6.35
(.025)
6.5
(.256)
1.5
(.059)
6.35
(.250)
13.1
(.516)
3.17
(.125)
10.0
(.394)
3.0
(.118)
6.35
(.025)
6.5
(.256)
1.5
(.059)
3.17
(.125)
10.0
(.394)
6.5
(.256)
*RHSCOMPIAN
*RoHS Directive 2002/95/EC Jan 27 2003, including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CHF5225CNF | 制造商:BOURNS 制造商全称:Bourns Electronic Solutions 功能描述:60 W Power RF Flanged Chip Termination |
| CHF5225CNF500L | 功能描述:高频/射频电阻 50ohms 60watt 5% RoHS:否 制造商:Bourns 电阻:50 Ohms 容差:5 % 功率额定值:100 W 封装 / 箱体:3523 (8958 metric) 温度系数: 系列:CHF 频率:4 GHz 电压额定值: 工作温度范围:- 55 C to + 150 C 端接类型:SMD/SMT 尺寸:5.842 mm W x 8.89 mm L x 1 mm H 封装:Bulk |
| CHF5225DNF500L | 功能描述:高频/射频电阻 50ohms 60watt 5% RoHS:否 制造商:Bourns 电阻:50 Ohms 容差:5 % 功率额定值:100 W 封装 / 箱体:3523 (8958 metric) 温度系数: 系列:CHF 频率:4 GHz 电压额定值: 工作温度范围:- 55 C to + 150 C 端接类型:SMD/SMT 尺寸:5.842 mm W x 8.89 mm L x 1 mm H 封装:Bulk |
| CHF5KP10 | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:Patented Flip Chip Series |
| CHF5KP100 | 制造商:MICROSEMI 制造商全称:Microsemi Corporation 功能描述:Patented Flip Chip Series |
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