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参数资料
| 型号： | CM1242-33CP |
| 厂商： | ON Semiconductor |
| 文件页数： | 4/4页 |
| 文件大小： | 0K |
| 描述： | IC ESD PROTECTION 1CH 2WLCSP |
| 标准包装： | 5,000 |
| 电压 - 反向隔离（标准值）： | 3.3V |
| 电压 - 击穿： | 6V |
| 电极标记： | 双向 |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 2-XFBGA，WLCSP |
| 供应商设备封装： | 2-WLCSP（0.6x0.3） |
| 包装： | 带卷 (TR) |
CM1242 ? 33CP
PACKAGE DIMENSIONS
WLCSP2, 0.6x0.3
CASE 567AV
ISSUE O
2X
0.02 C
D
A B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
MILLIMETERS
2X
0.02 C
TOP VIEW
0.02 C
0.02 C
A1
SIDE VIEW
E
A
C
SEATING
PLANE
DIM
A
A1
b
D
E
e
L
MIN MAX
0.25 0.30
0.00 0.05
0.14 0.17
0.60 BSC
0.30 BSC
0.36 BSC
0.19 0.24
e
2X b
2X
L
RECOMMENDED
SOLDER FOOTPRINT*
2X
0.33
0.05 C A B
BOTTOM VIEW
2X
0.28
0.81
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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CM1242 ? 33CP/D
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