参数资料
型号: CM1409-08DE
厂商: ON Semiconductor
文件页数: 7/8页
文件大小: 0K
描述: ARRAY 8CH LCD/CAM EMI FLTR 16DFN
产品变化通告: Product Obsolescence 30/Jun/2011
标准包装: 3,000
类型: 低通
技术: RC(Pi)
通道数: 8
中心 / 截止频率: 110MHz(截止值)
衰减值: 30dB @ 800MHz ~ 6GHz
电阻 - 通道 (Ohms): 100
值: R = 100 欧姆,C = 15pF
ESD 保护:
滤波器阶数: 2nd
应用: 移动设备的数据线路
封装/外壳: 16-WFDFN 裸露焊盘
尺寸/尺寸: 0.157" L x 0.063" W(4.00mm x 1.60mm)
高度: 0.031"(0.80mm)
包装: 带卷 (TR)
工作温度: -40°C ~ 85°C
CM1409
PACKAGE DIMENSIONS
WDFN12, 3x1.35, 0.5P
CASE 511AZ ? 01
ISSUE O
PIN ONE
REFERENCE
2X
0.10 C
2X
0.10 C
0.10 C
0.08 C
NOTE 4
D
TOP VIEW
DETAIL B
SIDE VIEW
A B
E
(A3)
A1
A
C
L1
EXPOSED Cu
SEATING
PLANE
L
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
MOLD CMPD
A1
DETAIL B
ALTERNATE
CONSTRUCTIONS
L
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS TH E TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.70 0.80
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.30
D 3.00 BSC
D2 2.40 2.60
E 1.35 BSC
E2 0.30 0.50
e 0.50 BSC
K 0.22 REF
L 0.20 0.30
L1 ??? 0.15
DETAIL A
1
D2
6
12X
L
E2
K
12
7
12X
b
RECOMMENDED
SOLDERING FOOTPRINT*
2.60
12X
0.45
e
0.10 C A B
e/2
BOTTOM VIEW
0.05 C
NOTE 3
1.65
0.50
12X
0.30
0.50
PITCH
DIMENSION: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
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