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参数资料
| 型号： | CP2104-F03-GM |
| 厂商： | SILICON LABORATORIES |
| 元件分类： | 总线控制器 |
| 中文描述： | UNIVERSAL SERIAL BUS CONTROLLER, QCC24 |
| 封装： | 4 X 4 MM, ROHS COMPLIANT, MO-220WGGD, QFN-24 |
| 文件页数： | 2/22页 |
| 文件大小： | 219K |
| 代理商： | CP2104-F03-GM |
CP2104
10
Rev. 1.0
Figure 4. QFN-24 Recommended PCB Land Pattern
Table 9. QFN-24 PCB Land Pattern Dimensions
Dimension
Min
Max
Dimension
Min
Max
C1
3.90
4.00
X2
2.70
2.80
C2
3.90
4.00
Y1
0.65
0.75
E
0.50 BSC
Y2
2.70
2.80
X1
0.20
0.30
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
Solder Mask Design
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
mask and the metal pad is to be 60
m minimum, all the way around the pad.
Stencil Design
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
to assure good solder paste release.
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A 2x2 array of 1.10 mm x 1.10 mm openings on a 1.30 mm pitch should be used for the center
pad.
Card Assembly
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
Body Components.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CP2104-F03-GMR | 功能描述:输入/输出控制器接口集成电路 USB to UART bridge RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| CP2104-MINIEK | 制造商:Silicon Laboratories Inc 功能描述:KIT EVAL FOR CP2104-MINI |
| CP2104SX0810GM | 制造商:Silicon Laboratories Inc 功能描述: |
| CP2104SX0810GMR | 制造商:Silicon Laboratories Inc 功能描述: |
| CP2105 | 制造商:SILABS 制造商全称:SILABS 功能描述:USB DRIVER CUSTOMIZATION |
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