参数资料
| 型号： | CP82C89 |
| 厂商： | Intersil |
| 文件页数： | 2/13页 |
| 文件大小： | 0K |
| 描述： | IC ARBITER BUS 5V 8MHZ 20-DIP |
| 标准包装： | 180 |
| 控制器类型： | CMOS 优先中断控制器 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 电流 - 电源： | 1mA |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 20-DIP（0.300"，7.62mm） |
| 供应商设备封装： | 20-PDIP |
| 包装： | 管件 |
10
FN2980.2
February 27, 2006
Absolute Maximum Ratings
Thermal Information
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8.0V
Input, Output or I/O Voltage . . . . . . . . . . . . GND -0.5V to VCC +0.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Operating Voltage Range. . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Operating Temperature Range
C82C89 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
M82C89 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C
Thermal Resistance (Note 1)
θJA (°C/W) θJC (°C/W)
CERDIP Package. . . . . . . . . . . . . . . . .
80
20
PDIP Package* . . . . . . . . . . . . . . . . . .
75
N/A
Storage Temperature Range . . . . . . . . . . . . . . . . . .-65°C to +150°C
Maximum Junction Temperature
Ceramic Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C
Plastic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
*Pb-free PDIPs can be used for through hole wave solder processing
only. They are not intended for use in Reflow solder processing
applications.
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .200 Gates
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
DC Electrical Specifications
VCC = 5.0V ± 10%;
TA = 0°C to +70°C (C82C89);
TA = -55°C to +125°C (M82C89)
SYMBOL
PARAMETER
TEST CONDITIONS
MIN
MAX
UNITS
VIH
Logical One Input Voltage
C82C89,
M82C89, Note 1
2.0
2.2
-
V
VIL
Logical Zero Input Voltage
Note 1
-
0.8
V
VIHC
CLK Logical One Input Voltage
0.7 VCC
-
V
VILC
CLK Logical Zero Input Voltage
-
0.2 VCC
V
VOL
Output Low Voltage
BUSY, CBRQ
IOL = 20mA
-
0.45
V
AEN
IOL = 16mA
-
0.45
V
BPRO, BREQ
IOL = 8mA
-
0.45
V
VOH1
Output High Voltage
BUSY, CBRQ
Open-Drain
VOH2
Output High Voltage
IOH = -2.5mA
3.0
-
V
All Other Outputs
IOH = -100AVCC -0.4
-
V
II
Input Leakage Current
VIN = GND or VCC, DIP Pins 1-6, 9, 14-19
-1.0
1.0
A
IO
I/O Leakage
VO = GND or VCC, DIP Pins 11-12
-10.0
10.0
A
ICCSB
Standby Power Supply
VCC = 5.5V, VIN = VCC or GND, Outputs Open
-
10
A
ICCOP
Operating Power Supply Current
VCC = 5.5V, Outputs Open, Note 2
-
1
mA/MHz
NOTES:
1. Does not apply to IOB, RESB, or ANYRQST. These are strap options and should be held to VCC or GND.
2. Maximum current defined by CLK or BCLK, whichever has the highest operating frequency
Capacitance TA = +25°C
SYMBOL
PARAMETER
TEST CONDITIONS
TYPICAL
UNITS
CIN
Input Capacitance
FREQ = 1MHz, all measurements are
referenced to device GND
10
pF
COUT
Output Capacitance
10
pF
CIO
I/O Capacitance
15
pF
82C89
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