参数资料
型号: CPC5603CTR
厂商: IXYS Integrated Circuits Division
文件页数: 4/5页
文件大小: 0K
描述: MOSFET N-CH 415V 5MA SOT-223
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 耗尽模式
漏极至源极电压(Vdss): 415V
电流 - 连续漏极(Id) @ 25° C: 5mA
开态Rds(最大)@ Id, Vgs @ 25° C: 14 欧姆 @ 50mA,350mV
输入电容 (Ciss) @ Vds: 300pF @ 0V
功率 - 最大: 2.5W
安装类型: 表面贴装
封装/外壳: TO-261-4,TO-261AA
供应商设备封装: SOT-223
包装: 标准包装
产品目录页面: 2629 (CN2011-ZH PDF)
其它名称: CLA299DKR
I NTEGRATED C IRCUITS D IVISION
CPC5603
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020 , in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033 .
Device
CPC5603C
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive , and should be handled according to the industry standard JESD-625 .
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
CPC5603C
Maximum Temperature x Time
260oC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
Pb
e 3
4
www.ixysic.com
R07
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