参数资料
型号: CPC7508BTR
厂商: CLARE INC
元件分类: 通信及网络
中文描述: SPECIALTY TELECOM CIRCUIT, PDSO16
封装: ROHS COMPLIANT, SOIC-16
文件页数: 4/14页
文件大小: 393K
代理商: CPC7508BTR
CPC7508
12
www.clare.com
R04
Neither the TSD input control nor the TSD output
functions are affected by the latch function. Since
internal thermal shutdown control and external “All-off”
control is not affected by the state of the LATCH
enable input, TSD will override state control.
2.5 Power Supplies
Only a +12 V supply and ground are connected to the
CPC7508. Switch state control is powered exclusively
by the +12 V supply while internal level shifters
provide the necessary translation from the low voltage
inputs to the switch driver circuitry.
2.6 Protection
The CPC7508 uses a combination of current limiting
and a thermal shutdown mechanism to protect the
SLIC device and itself from damage during transient
line faults such as lightning.
For power induction or power-cross fault conditions
the DC current limit function restricts the maximum
current through the switches. Excess power
dissipation during current limiting events will trigger
the thermal shutdown circuit to shut down all of the
switches.
2.6.1 Current Limiting function
If a lightning strike transient occurs when any of the
devices switches are operating, the current will be
restricted by the dynamic current limit response of the
active switches. For instance, during the talk state,
when a 1000V 10x1000
μs lightning pulse
(GR-1089-CORE) is applied to the line though a
properly clamped external protector, the current seen
at TLINE and RLINE will be a pulse with a typical
magnitude of 2.5 A and a duration less than 0.5
μs.
If a power-cross fault occurs with the device in the talk
state, the current is passed though the break switches
SW1 and SW2 but is limited by the DC current limit
response of the two break switches. The DC current
limit specified over temperature is between 80 mA and
425 mA and the circuitry has a negative temperature
coefficient. As a result, if the device is subjected to
extended heating due to a power cross fault condition,
the measured current at TLINE and RLINE will decrease
as the device temperature increases. If the device
temperature rises sufficiently, the temperature
shutdown mechanism will activate and the device will
enter the all-off state.
2.6.2 Thermal Shutdown
The thermal shutdown mechanism activates when the
device die temperature reaches a minimum of 110
° C,
placing the device in the all-off state regardless of
logic input. During thermal shutdown events the TSD
pin will output a logic low with a nominal 0 V level. A
logic high is output from the TSD pin during normal
operation with a typical output level equal to VDD.
If presented with a short duration transient such as a
lightning event, the thermal shutdown feature will
typically not activate. But in an extended power-cross
event, the device temperature will rise and the thermal
shutdown mechanism will activate forcing the switches
to the all-off state. At this point the current measured
into TLINE or RLINE will drop to zero. Once the device
enters thermal shutdown it will remain in the all-off
state until the temperature of the device drops below
the de-activation level of the thermal shutdown circuit.
This permits the device to autonomously return to
normal operation. If the transient has not passed,
current will again flow up to the value allowed by the
dynamic DC current limiting of the switches and
heating will resume, reactivating the thermal shutdown
mechanism. This cycle of entering and exiting the
thermal shutdown mode will continue as long as the
fault condition persists. If the magnitude of the fault
condition is great enough, the external secondary
protector will activate shunting the fault current to
ground.
2.7 External Protection Elements
The CPC7508 requires only the over voltage
secondary protector normally used to protect the
ringing SLIC placed on the line side of the LCAS. The
secondary protector must limit voltage transients to
levels that do not exceed the breakdown voltage or
input-output isolation barrier of the CPC7508. Use of a
foldback or crowbar type protector is recommended to
minimize stresses on the LCAS.
Consult Clare’s application note, AN-100, “Designing
to the specifications of external secondary protectors,
fused resistors and PTCs.
相关PDF资料
PDF描述
CPC7508B
CPC7581BC
CPC7581BBTR
CPC7581BATR
CPC7581BCTR
相关代理商/技术参数
参数描述
CPC750J 制造商:CORNELL DUBILIER ELECTRONICS 功能描述:Cap Ceramic 75pF 1000V C0G 5% (11 X 4.5mm) Radial 6.4mm 125°C
CPC7512Z 功能描述:IC ANALOG SW ARRAY DUAL 20SOIC 制造商:ixys integrated circuits division 系列:- 包装:管件 零件状态:有效 应用:超声 多路复用器/解复用器电路:3:1 开关电路:- 通道数:2 导通电阻(最大值):29 欧姆(标准) 电压 -?电源,单(V+):4.5 V ~ 5.5 V 电压 - 电源,双(V±):- -3db 带宽:- 特性:故障保护,T 开关配置 工作温度:-40°C ~ 85°C(TA) 封装/外壳:20-SOIC(0.295",7.50mm 宽) 供应商器件封装:20-SOIC 标准包装:40
CPC7512ZTR 功能描述:IC ANALOG SW ARRAY DUAL 20SOIC 制造商:ixys integrated circuits division 系列:- 包装:带卷(TR) 零件状态:有效 应用:超声 多路复用器/解复用器电路:3:1 开关电路:- 通道数:2 导通电阻(最大值):29 欧姆(标准) 电压 -?电源,单(V+):4.5 V ~ 5.5 V 电压 - 电源,双(V±):- -3db 带宽:- 特性:故障保护,T 开关配置 工作温度:-40°C ~ 85°C(TA) 封装/外壳:20-SOIC(0.295",7.50mm 宽) 供应商器件封装:20-SOIC 标准包装:1,000
CPC7514Z 功能描述:IC LINE CARD ACCESS SWITC 20SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 电信 系列:- 产品培训模块:Lead (SnPb) Finish for COTS 产品变化通告:Product Discontinuation 06/Feb/2012 标准包装:750 系列:*
CPC7514ZTR 功能描述:IC ANALOG SW ARRAY QUAD 20-SOIC RoHS:是 类别:集成电路 (IC) >> 接口 - 模拟开关,多路复用器,多路分解器 系列:- 其它有关文件:STG4159 View All Specifications 标准包装:5,000 系列:- 功能:开关 电路:1 x SPDT 导通状态电阻:300 毫欧 电压电源:双电源 电压 - 电源,单路/双路(±):±1.65 V ~ 4.8 V 电流 - 电源:50nA 工作温度:-40°C ~ 85°C 安装类型:表面贴装 封装/外壳:7-WFBGA,FCBGA 供应商设备封装:7-覆晶 包装:带卷 (TR)