参数资料
型号: CPC7595ZCTR
厂商: CLARE INC
元件分类: 通信及网络
中文描述: SPECIALTY TELECOM CIRCUIT, PDSO20
封装: ROHS COMPLIANT, SOIC-20
文件页数: 15/24页
文件大小: 658K
代理商: CPC7595ZCTR
CPC7595
22
www.clare.com
R02
3.1.3 CPC7595M
NOTE: As the metallic pad on the bottom of the DFN
package is connected to the substrate of the die, Clare
recommends that no printed circuit board traces cross
this area to avoid potential shorting issues.
28-Lead DFN Package
Recommended PCB Land Pattern
Dimensions
mm
(inches)
7.0
(0.276)
11.0
(0.433)
7.5±0.05
(0.296±0.002)
5.0±0.05
(0.197±0.002)
0.75
(0.030)
0.33 +0.07,-0.05
(0.013 +0.003, -0.002)
0.55±0.10
(0.022±0.004)
Bottom side
metallic pad
Pin 1
0.90±0.10
(0.036 ±0.004)
0.02 +0.03, -0.02
(0.001 +0.0012, -0.001)
Seating Plane
0.20
(0.008)
Pin 1
6.70
(0.264)
0.75
(0.03)
0.35
(0.016)
1.05
(0.045)
相关PDF资料
PDF描述
CPC7595BC
CPC7595ZATR
CPC7595MC
CPC7595BCTR
CPC7595ZB
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