参数资料
| 型号： | CT1206K25G |
| 厂商： | EPCOS Inc |
| 文件页数： | 73/82页 |
| 文件大小： | 0K |
| 描述： | VARISTOR 25VRMS 1206 SMD |
| 标准包装： | 1 |
| 系列： | CT 标准 |
| 变阻器电压： | 39V |
| 电流 - 浪涌： | 200A |
| 电路数： | 1 |
| 最大交流电压： | 25VAC |
| 最大直流电压： | 31VDC |
| 能量： | 1.0J |
| 封装/外壳： | 1206（3216 公制） |
| 其它名称： | 495-4401-6 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页当前第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页
Multilayer varistors (MLVs)
Standard series
A further advantage of adhesion is that the components are subjected to virtually no temperature
shock at all. The curing temperatures of the adhesives are between 120 ° C and 180 ° C, typical
curing times are between 30 minutes and one hour.
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-
tor of at least 2, as is to be expected due to the elasticity of the glued joints.
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-
sult in electrical data different to those of soldered components. Users must pay special attention
to this in RF applications.
6
Solderability tests
Test
Standard
Test conditions
Sn-Pb soldering
Test conditions
Pb-free soldering
Criteria/ test results
Wettability
Leaching
resistance
Thermal shock
(solder shock)
IEC Immersion in
60068-2-58 60/40 SnPb solder
using non-activated
flux at 215 ± 3 ° C
for 3 ± 0.3 s
IEC Immersion in
60068-2-58 60/40 SnPb
solder using
mildly activated flux
without preheating
at 260 ± 5 ° C
for 10 ± 1 s
Dip soldering at
300 ° C/5 s
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245 ± 5 ° C
for 3 ± 0.3 s
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255 ± 5 ° C
for 10 ± 1 s
Dip soldering at
300 ° C/5 s
Covering of 95% of
end termination,
checked by visual
inspection
No leaching of
contacts
No deterioration of
electrical parameters.
Capacitance change:
≤ ± 15%
Tests of resistance IEC Immersion in Immersion in
to soldering heat 60068-2-58 60/40 SnPb for 10 s Sn96.5Ag3.0Cu0.5
for SMDs at 260 ° C for 10 s at 260 ° C
Change of varistor
voltage:
≤ ± 5%
Tests of resistance IEC
to soldering heat 60068-2-20
for radial leaded
components
(SHCV)
Immersion
of leads in
60/40 SnPb
for 10 s at 260 ° C
Immersion
of leads in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 ° C
Change of varistor
voltage: ≤ ± 5%
Change of
capacitance X7R:
≤ 5/+10%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 72 of 81
相关PDF资料 |
PDF描述 |
|---|---|
| LT6200IS6-5#TRMPBF | IC OP AMP 800MHZ R-R I/O SOT23-6 |
| LT6200IS6-5#TRM | IC OP AMP 800MHZ R-R I/O SOT23-6 |
| 3410.0031.03 | FUSE MGA 125V 1A |
| 3410.0029.04 | FUSE MGA 125V 750MA |
| 3410.0029.03 | FUSE MGA 125V 750MA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| CT1206K30G | 功能描述:VARISTOR 30VRMS 1206 SMD RoHS:是 类别:过电压，电流，温度装置 >> TVS - 变阻器，MOV 系列:CT 标准 产品培训模块:Metal Oxide Varistors 产品目录绘图:ZA Series_Disc 14,20mm_V68~100 Bottom ZA Series_Disc 14mm 标准包装:700 系列:ZA 变阻器电压:110V 电流 - 浪涌:4.5kA 电路数:1 最大交流电压:60VAC 最大直流电压:81VDC 能量:20J 封装/外壳:圆盘 14mm 产品目录页面:2355 (CN2011-ZH PDF) 其它名称:F3074V100ZA15P-ND |
| CT1206K35G | 制造商:EPCOS 制造商全称:EPCOS 功能描述:Multilayer technology |
| CT1206K40G | 功能描述:VARISTOR 40VRMS 1206 SMD RoHS:是 类别:过电压，电流，温度装置 >> TVS - 变阻器，MOV 系列:CT 标准 标准包装:1 系列:- 变阻器电压:33V 电流 - 浪涌:4A 电路数:1 最大交流电压:14VAC 最大直流电压:18VDC 能量:0.015J 封装/外壳:0402（1005 公制） 其它名称:478-6870-6 |
| CT1206K50G | 制造商:EPCOS 制造商全称:EPCOS 功能描述:Multilayer technology |
| CT1206K60G | 制造商:TDK-EPC 功能描述:Var MOV 60VAC/85VDC 100A 100V 1206 SMD Blister T/R 制造商:TDK-EPC 功能描述:Var MLV 60VAC/85VDC 100A 100V 1206 SMD Blister T/R 制造商:EPCOS 功能描述:Var MOV 60VAC/85VDC 100A 100V 1206 SMD Blister T/R 制造商:EPCOS 功能描述:Var MLV 60VAC/85VDC 100A 100V 1206 SMD Blister T/R |
发布紧急采购，3分钟左右您将得到回复。