参数资料
| 型号： | CU4032K95G2 |
| 厂商： | EPCOS Inc |
| 文件页数： | 26/35页 |
| 文件大小： | 0K |
| 描述： | VARISTOR STD 95VRMS 4032 SMD |
| 产品目录绘图： | CU4032K Series_Max V Allowance 11~175 Side1 CU4032K Series_Max V Allowance 11~175 Side2 |
| 标准包装： | 1,000 |
| 系列： | CU |
| 变阻器电压： | 150V |
| 电流 - 浪涌： | 1.2kA |
| 电路数： | 1 |
| 最大交流电压： | 95VAC |
| 最大直流电压： | 125VDC |
| 能量： | 7.6J |
| 封装/外壳： | 4032（1080 公制） |
| 其它名称： | B72660M 950K 72 B72660M0950K072 B72660M950K72 |
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SMD disk varistors (CU varistors)
Standard series
A further advantage of adhesion is that the components are subjected to virtually no temperature
shock at all. The curing temperatures of the adhesives are between 120 ° C and 180 ° C, typical
curing times are between 30 minutes and one hour.
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-
tor of at least 2, as is to be expected due to the elasticity of the glued joints.
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-
sult in electrical data different to those of soldered components. Users must pay special attention
to this in RF applications.
6
Solderability tests
Test
Standard
Test conditions
Test conditions
Criteria/ test results
Sn-Pb soldering
Pb-free soldering
Wettability
IEC
Immersion in
Immersion in
Covering of 95% of
60068-2-58 60/40 SnPb solder
using non-activated
flux at 215 ± 3 ° C
for 3 ± 0.3 s
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245 ± 5 ° C
for 3 ± 0.3 s
end termination,
checked by visual
inspection
Leaching
IEC
Immersion in
Immersion in
No leaching of
resistance
Thermal shock
(solder shock)
60068-2-58 60/40 SnPb
solder using
mildly activated flux
without preheating
at 260 ± 5 ° C
for 10 ± 1 s
Dip soldering at
300 ° C/5 s
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255 ± 5 ° C
for 10 ± 1 s
Dip soldering at
300 ° C/5 s
contacts
No deterioration of
electrical parameters.
Capacitance change:
≤ ± 15%
Tests of resistance IEC
Immersion in
Immersion in
Change of varistor
to soldering heat
60068-2-58 60/40 SnPb for 10 s Sn96.5Ag3.0Cu0.5
voltage:
for SMDs
Tests of resistance IEC
at 260 ° C
Immersion
for 10 s at 260 ° C
Immersion
≤ ± 5%
Change of varistor
to soldering heat
for radial leaded
components
(SHCV)
60068-2-20
of leads in
60/40 SnPb
for 10 s at 260 ° C
of leads in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 ° C
voltage: ≤ ± 5%
Change of
capacitance X7R:
≤
5/+10%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 26 of 35
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