参数资料
| 型号： | CU4032K95G2 |
| 厂商： | EPCOS Inc |
| 文件页数： | 27/35页 |
| 文件大小： | 0K |
| 描述： | VARISTOR STD 95VRMS 4032 SMD |
| 产品目录绘图： | CU4032K Series_Max V Allowance 11~175 Side1 CU4032K Series_Max V Allowance 11~175 Side2 |
| 标准包装： | 1,000 |
| 系列： | CU |
| 变阻器电压： | 150V |
| 电流 - 浪涌： | 1.2kA |
| 电路数： | 1 |
| 最大交流电压： | 95VAC |
| 最大直流电压： | 125VDC |
| 能量： | 7.6J |
| 封装/外壳： | 4032（1080 公制） |
| 其它名称： | B72660M 950K 72 B72660M0950K072 B72660M950K72 |
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SMD disk varistors (CU varistors)
Standard series
Note:
Leaching of the termination
Effective area at the termination might be lost if the soldering temperature and/or immersion time
are not kept within the recommended conditions. Leaching of the outer electrode should not ex-
ceed 25% of the chip end area (full length of the edge A-B-C-D) and 25% of the length A-B,
shown below as mounted on substrate.
As a single chip
As mounted on substrate
7
7.1
Notes for proper soldering
Preheating and cooling
According to JEDEC J-STD-020D. Please refer to chapter 2.
7.2
Repair / rework
Manual soldering with a soldering iron must be avoided, hot-air methods are recommended for
rework purposes.
7.3
Cleaning
All environmentally compatible agents are suitable for cleaning. Select the appropriate cleaning
solution according to the type of flux used. The temperature difference between the components
and cleaning liquid must not be greater than 100 ° C. Ultrasonic cleaning should be carried out
with the utmost caution. Too high ultrasonic power can impair the adhesive strength of the metal-
lized surfaces.
7.4
Solder paste printing (reflow soldering)
An excessive application of solder paste results in too high a solder fillet, thus making the chip
more susceptible to mechanical and thermal stress. Too little solder paste reduces the adhesive
strength on the outer electrodes and thus weakens the bonding to the PCB. The solder should be
applied smoothly to the end surface.
Please read Cautions and warnings and
Important notes at the end of this document.
Page 27 of 35
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