参数资料
型号: DAC8248FSZ-REEL
厂商: Analog Devices Inc
文件页数: 6/16页
文件大小: 0K
描述: IC DAC 12BIT DUAL W/BUFF 24SOIC
产品培训模块: Data Converter Fundamentals
DAC Architectures
标准包装: 1,000
设置时间: 1µs
位数: 12
数据接口: 并联
转换器数目: 2
电压电源: 单电源
功率耗散(最大): 50µW
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 24-SOIC(0.295",7.50mm 宽)
供应商设备封装: 24-SOIC W
包装: 带卷 (TR)
输出数目和类型: 2 电流,单极;2 电流,双极
采样率(每秒): 1M
DAC8248
–14–
REV. B
ground as shown in Figure 9. The output voltage will be be-
tween +5 V and +10 V depending on the digital input code.
The output expression is given by:
VOUT = VOS × (D/4096)(VOS)
where VOS = Offset Reference Voltage (+5 V in Figure 9)
D = Decimal Equivalent of the Digital Input Word
VOLTAGE SWITCHING MODE
Figure 10 shows the DAC8248 in another single supply configu-
ration. The R-2R ladder is used in the voltage switching mode
and functions as a voltage divider. The output voltage (at the
VREF pin) exhibits a constant impedance R (typically 11 k
) and
must be buffered by an op amp. The RFB pins are not used and
are left open. The reference input voltage must be maintained
within +1.25 V of AGND, and VDD between +12 V and +15 V;
this ensures that device accuracy is preserved.
The output voltage expression is given by:
VOUT = VREF (D/4096)
where D = Decimal Equivalent of the Digital Input Word
APPLICATIONS TIPS
GENERAL GROUND MANAGEMENT
Grounding techniques should be tailored to each individual sys-
tem. Ground loops should be avoided, and ground current paths
should be as short as possible and have a low impedance.
The DAC8248’s AGND and DGND pins should be tied to-
gether at the device socket to prevent digital transients from ap-
pearing at the analog output. This common point then becomes
the single ground point connection. AGND and DGND is then
brought out separately and tied to their respective power supply
grounds. Ground loops can be created if both grounds are tied
together at more than one location, i.e., tied together at the de-
vice and at the digital and analog power supplies.
PC board ground plane can be used for the single point ground
connection should the connections not be practical at the device
socket. If neither of these connections are practical or allowed,
then the device should be placed as close as possible to the sys-
tems single point ground connection. Back-to-back Schottky di-
odes should then be connected between AGND and DGND.
POWER SUPPLY DECOUPLING
Power supplies used with the DAC8248 should be well filtered
and regulated. Local supply decoupling consisting of a 1
F to
10
F tantalum capacitor in parallel with a 0.1 F ceramic is
highly recommended. The capacitors should be connected be-
tween the VDD and DGND pins and at the device socket.
Figure 9. Single Supply Operation (Current Switching Mode)
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