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参数资料
| 型号： | DAC8413FPCZ-REEL |
| 厂商： | ANALOG DEVICES INC |
| 元件分类： | DAC |
| 英文描述： | QUAD, PARALLEL, WORD INPUT LOADING, 10 us SETTLING TIME, 12-BIT DAC, PQCC28 |
| 封装： | PLASTIC, MO-047AB, LCC-28 |
| 文件页数： | 18/20页 |
| 文件大小： | 531K |
| 代理商： | DAC8413FPCZ-REEL |
DAC8412/DAC8413
Rev. F | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
TA = +25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VSS to VDD
0.3 V, +33.0 V
VSS to VLOGIC
0.3 V, +33.0 V
VLOGIC to DGND
0.3 V, +7.0 V
VSS to VREFL
0.3 V, +VSS 2.0 V
VREFH to VDD
+2.0 V, +33.0 V
VREFH to VREFL
+2.0 V, VSS VDD
Current into Any VSS pin
±15 mA
Digital Input Voltage to DGND
0.3 V, VLOGIC + 0.3 V
Digital Output Voltage to DGND
0.3 V, +7.0 V
Operating Temperature Range
EP, FP, FPC
40°C to +85°C
AT, BT, BTC
55°C to +125°C
Junction Temperature
150°C
Storage Temperature Range
65°C to +150°C
Power Dissipation Package
1000 mW
Lead Temperature
JEDEC Industry Standard
Soldering
J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case mounting conditions, that is, a
device in socket.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
28-Lead Plastic DIP (PDIP)
48
22
°C/W
28-Terminal Ceramic Leadless Chip Carrier (LLC)
70
28
°C/W
28-Lead Plastic Leaded Chip Carrier (PLLC)
63
25
°C/W
28-Lead Ceramic Dual In-Line Package (CERDIP)
51
9
°C/W
ESD CAUTION
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