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参数资料
| 型号： | DC1783A-H |
| 厂商： | Linear Technology |
| 文件页数： | 16/24页 |
| 文件大小： | 0K |
| 描述： | BOARD SAR ADC LTC2376-18 |
| 软件下载： | QuikEval II System |
| 设计资源： | DC1783A Design Files DC1783A Schematic |
| 标准包装： | 1 |
| 系列： | QuikEval™ |
| ADC 的数量： | 1 |
| 位数： | 18 |
| 采样率（每秒）： | 250k |
| 数据接口： | 串行，SPI? |
| 输入范围： | ±VREF |
| 在以下条件下的电源（标准）： | 3.4mW @ 250kSPS |
| 工作温度： | 0°C ~ 70°C |
| 已用 IC / 零件： | LTC2376-18 |
| 已供物品： | 板 |
| 相关产品： | LTC2376IDE-16#TRPBF-ND - IC ADC 16BIT SPI 250KSPS 16DFN LTC2376IDE-16#PBF-ND - IC ADC 16BIT SPI 250KSPS 16DFN LTC2376HMS-16#TRPBF-ND - IC ADC 16BIT SPI 250KSPS 16MSOP LTC2376HMS-16#PBF-ND - IC ADC 16BIT SPI 250KSPS 16MSOP LTC2376CDE-16#TRPBF-ND - IC ADC 16BIT SPI 250KSPS 16DFN LTC2376CDE-16#PBF-ND - IC ADC 16BIT SPI 250KSPS 16DFN LTC2376IMS-16#TRPBF-ND - IC ADC 16BIT 250KSPS 16-MSOP LTC2376CMS-16#TRPBF-ND - IC ADC 16BIT 250KSPS 16-MSOP LTC2376IMS-16#PBF-ND - IC ADC 16BIT 250KSPS 16-MSOP LTC2376CMS-16#PBF-ND - IC ADC 16BIT 250KSPS 16-MSOP 更多... |
LTC2376-18
23
237618f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
3.00 ±0.10
(2 SIDES)
4.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.70 ± 0.10
0.75 ±0.05
R = 0.115
TYP
R = 0.05
TYP
3.15 REF
1.70 ± 0.05
1
8
16
9
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DE16) DFN 0806 REV
PIN 1 NOTCH
R = 0.20 OR
0.35
45°
CHAMFER
3.15 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20 ±0.05
0.70 ±0.05
3.60 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
3.30 ±0.05
3.30 ±0.10
0.45 BSC
0.23 ± 0.05
0.45 BSC
DE Package
16-Lead Plastic DFN (4mm
× 3mm)
(Reference LTC DWG # 05-08-1732 Rev )
MS Package
16-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1669 Rev )
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
0.127
(.035
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
0.038
(.0120
.0015)
TYP
0.50
(.0197)
BSC
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
MSOP (MS16) 1107 REV
0.53
0.152
(.021
.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 –0.27
(.007 – .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
16151413121110
1234567 8
9
0.254
(.010)
0 – 6 TYP
DETAIL “A”
GAUGE PLANE
4.039
0.102
(.159
.004)
(NOTE 3)
0.1016
0.0508
(.004
.002)
3.00
0.102
(.118
.004)
(NOTE 4)
0.280
0.076
(.011
.003)
REF
4.90
0.152
(.193
.006)
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