参数资料
型号: DC1786A
厂商: Linear Technology
文件页数: 29/36页
文件大小: 0K
描述: BOARD DEMO LTC2871
设计资源: DC1786A Design Files
DC1786A Schematic
标准包装: 1
主要目的: 接口,收发器,RS-232/RS-485
嵌入式:
已用 IC / 零件: LTC2871
主要属性: 3 个驱动器,3 个接收器
次要属性: 3 V ~ 5.5 V 电源
已供物品:
相关产品: LTC2871CUHF#PBF-ND - IC TXRX RS485/RS422 38-QFN
LTC2871IUHF#PBF-ND - IC TXRX RS485/RS422 38-QFN
LTC2871CFE#PBF-ND - IC TXRX RS485/RS422 38-TSSOP
LTC2871IFE#PBF-ND - IC TXRX RS485/RS422 38-TSSOP
LTC2871CUHF#TRPBF-ND - IC TXRX RS485/RS422 38-QFN
LTC2871IFE#TRPBF-ND - IC TXRX RS485/RS422 38-TSSOP
LTC2871IUHF#TRPBF-ND - IC TXRX RS485/RS422 38-QFN
LTC2871CFE#TRPBF-ND - IC TXRX RS485/RS422 38-TSSOP
LTC2870/LTC2871
35
28701f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
UHF Package
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701 Rev C)
5.00
0.10
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
OUTLINE M0-220 VARIATION WHKD
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
PIN 1
TOP MARK
(SEE NOTE 6)
37
1
2
38
BOTTOM VIEW—EXPOSED PAD
5.50 REF
5.15 ± 0.10
7.00
0.10
0.75
0.05
R = 0.125
TYP
R = 0.10
TYP
0.25
0.05
(UH) QFN REF C 1107
0.50 BSC
0.200 REF
0.00 – 0.05
RECOMMENDED SOLDER PAD LAYOUT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.00 REF
3.15 ± 0.10
0.40 0.10
0.70
0.05
0.50 BSC
5.5 REF
3.00 REF
3.15 ± 0.05
4.10
0.05
5.50
0.05
5.15 ± 0.05
6.10
0.05
7.50
0.05
0.25
0.05
PACKAGE
OUTLINE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 NOTCH
R = 0.30 TYP OR
0.35
45 CHAMFER
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