参数资料
型号: DCK-3R3E224U-E
厂商: Elna America
文件页数: 126/145页
文件大小: 0K
描述: CAP SUPER 220MF 3.3V COIN SMD
产品目录绘图: DC Series Front
DC Series Side
标准包装: 200
系列: DCK
电容: 220mF
电压 - 额定: 3.3V
容差: -20%,+80%
ESR(等效串联电阻): 200 欧姆
寿命@温度: 60°C 时为 1000 小时
安装类型: 表面贴装
封装/外壳: 币形,宽型端子 - 反侧
引线间隔: 0.079"(2.00mm)
包装: 散装
尺寸/尺寸: 0.268" 直径(6.80mm)
高度 - 座高(最大): 0.083"(2.10mm)
工作温度: -10°C ~ 60°C
产品目录页面: 1912 (CN2011-ZH PDF)
其它名称: 604-1007
ELECTRIC DOUBLE LAYER CAPACITORS
② Keep the product in a place where the
temperature is 5 ℃~ 30 ℃ and the humidity is lower
than 60%. Avoid an abrupt temperature change,
which may cause condensation or deterioration of
the product or liquid leakage.
③ Do not store EDLC at a place where there is a
possibility that they may get water, salt or oil spill.
④ Do not store EDLC at place where the air
contains dense hazardous gas (hydrogen sulfide,
sulfurous acid, nitrous acid, chlorine ammonia, etc.).
⑤ Do not store EDLC at a place where it gets
ultraviolet ray or radioactive ray.
13. Capacitors fitted with a relief valve
① The relief valve is provided with a valve function
with part of the case made thin to avoid explosion
by increased internal pressure when the capacitor
is under abnormal load such as overvoltage or
reverse voltage. After activation of the relief valve,
the capacitor must be replaced as it does not
restore.
② For the capacitors with a case relief valve,
provide a void on the top of the relief valve so as
not to hamper its activation. Make a void of 2 mm
or more for the product of φ 18 or less in diameter,
and a void of 3 mm or more for the product of φ 20
to φ 35 mm in diameter on the top.
■ Mounting
1. Do not overheat when soldered.
Depending on the type and size of the board, the
product may be subjected to overheat, leading to
loss of airtightness. This may greatly shorten the
product life or cause liquid leakage.
ln case of a 1.6mm-thick and single side printed
board. for example, keep the following soldering
conditions: temperature lower then 260 ℃ , time
shorter than 5 seconds.
When a board thinner than 1.6 mm or multi-layer
printed board is used, contact us.
ln the case of hand soldering, the iron tip
temperature is lower than 360 ℃ , time is shorter
than 3 seconds.
The coin types and multilayer coin types excluding
the DZ and reflow-compatible coin types use poly-
propylene as the packing material for sealing and
therefore susceptible to excessive heat. Note that
the component body temperature shall be controlled
so as not to exceed 90 ℃ including preheating.
2. When soldering the capacitor to the wiring
board, do not attach the body of the capacitor to
the circuit board.
If the body of the capacitor is attached directly to
the circuit board, the flux or solder can blow through
the through holes in the circuit board, negatively
impacting the capacitor.
Moreover, the heat influence at the time of soldering
can be reduced by floating the body.
?
4. Contact us when the product is attached by
adhesive bonding.
Certain types of adhesives are not compatible.
Paste bond partially between the product and the
board so that the product will not adhere completely
to the board.
Do not raise the temperature over the guaranteed
value while the bond is hardening.
5. Heating conditions of adhesive curing oven
During heating of the adhesive curing oven,
application of excessive heat may significantly shorten
the product life or cause liquid leakage. Control the
body temperature so as not to exceed 90 ℃ during
work while setting the allowable atmospheric
temperature below 110 ℃ , and allowable heating time
within 30 seconds.
For the heating conditions deviating from the above,
consult with us providing your temperature profile
conditions.
6. Be careful not to apply an excessive force to
the capacitor body, terminals or lead wires.
① Mount the capacitor while making sure that the
terminal spacing of the capacitor and the spacing
of the holes in the printed wiring board are aligned.
② lf the capacitor body is subjected to stress such
as grabbing, falling, bend, pushing or twisting after
mounted, its terminals may come off, leading to
open, short or liquid leakage.
■ Other cautions
1. Emergency procedures
lf the EDLC overheats or star ts to smell,
immediately switch off the units main power supply
to stop operation.
Keep your face and hands away from the EDLC,
since the temperature may be high enough to cause
the EDLC to ignite and burn.
2. Periodical inspections should be established
for the EDLC used in industrial appliances.
The following items should be checked:
① Appearance : Check if there is leakage.
② Electronic performance : Check the leakage
current, the electrostatic, the internal resistance and
other items described in the catalog or the product
specifications.
3. Disposing of EDLC.
① Punch a hole or crush the EDLC (to prevent
explosion) before incineration at approved facility.
② If they are not to be incinerated, bring them to a
professional industrial waste disposal company.
4.Other notes.
PIease refer to the following literature for anything
not described in the product specifications or the
catalog. (Technical Report of Japan Electronics and
Information Technology Industries Association
#EIAJ RCR-2370A “ Guideline of notabilia for fixed
electric double layer capacitors”)
3. Contact us when cleaning is necessary after
soldering.
Certain types of solvents are not compatible and
may cause damage.
NOTE
CAT.No.2008/2009E(2008.10.1)
Design, Speci?cations are subject to change without notice.
Ask factory for technical speci?cations before purchase and/or use.
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