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参数资料
| 型号： | DEHR33F821KB3B |
| 厂商： | Murata Electronics North America |
| 文件页数： | 70/84页 |
| 文件大小： | 0K |
| 描述： | CAP CER 820PF 3.15KV 10% RADIAL |
| 标准包装： | 3,000 |
| 系列： | DEH |
| 电容： | 820pF |
| 电压 - 额定： | 3150V（3.15kV） |
| 容差： | ±10% |
| 温度系数： | R |
| 安装类型： | 通孔 |
| 工作温度： | -25°C ~ 125°C |
| 应用： | 通用 |
| 封装/外壳： | 径向 - 圆盘形 |
| 尺寸/尺寸： | 0.472" 直径（12.00mm） |
| 高度 - 座高（最大）： | 0.591"（15.00mm） |
| 引线间隔： | 0.295"（7.50mm） |
| 特点： | 高电压，低耗散因子 |
| 包装： | 散装 |
| 引线型： | 直形 |
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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
High Voltage Ceramic Capacitors ! Caution
c ! Caution (Storage and Operating Condition)
C85E.pdf
Apr.7,2014
Operating and Storage Environment
The insulating coating of capacitors does not form a
perfect seal; therefore, do not use or store
capacitors in a corrosive atmosphere, especially
where chloride gas, sul?de gas, acid, alkali, salt
or the like are present. Also, avoid exposure to
moisture. Before cleaning, bonding or molding this
product, verify that these processes do not affect
product quality by testing the performance of a
cleaned, bonded or molded product in the intended
equipment. Store the capacitors where the
temperature and relative humidity do not exceed -10
to 40 degrees centigrade and 15 to 85%.
c ! Caution (Soldering and Mounting)
1. Vibration and Impact
Do not expose a capacitor or its lead wires to
excessive shock or vibration during use.
Excessive shock or vibration may cause fatigue
destruction of lead wires mounted on the circuit
board.
Please take measures to hold a capacitor on the
circuit boards by adhesive, molding resin or another
coating.
Please con?rm there is no in?uence of holding
measures on the product with the intended equipment.
2. Soldering
When soldering this product to a PCB/PWB, do not
exceed the solder heat resistance speci?cation of
the capacitor. Subjecting this product to excessive
heating could melt the internal junction solder and
may result in thermal shocks that can crack the
ceramic element.
Soldering the capacitor with a soldering iron should
be performed in following conditions.
Temperature of iron-tip: 400 degrees C. max.
Soldering iron wattage: 50W max.
Soldering time: 3.5 sec. max.
Use capacitors within 6 months after delivery.
Check the solderability after 6 months or more.
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT
AND CAUSE FUMING OR PARTIAL DISPERSION
WHEN THE PRODUCT IS USED.
3. Bonding, Resin Molding and Coating
For bonding, molding or coating this product, verify
that these processes do not affect the quality of the
capacitor by testing the performance of the bonded,
molded or coated product in the intended equipment.
When the amount of applications, dryness/hardening
conditions of adhesives and molding resins containing
organic solvents (ethyl acetate, methyl ethyl ketone,
toluene, etc). are unsuitable, the outer coating resin
of a capacitor is damaged by the organic solvents and
it may result, worst case, in a short circuit.
The variation in thickness of adhesive, molding resin
or coating may cause outer coating resin cracking
and/or ceramic element cracking of a capacitor in a
temperature cycling.
4. Treatment after Bonding, Resin Molding and Coating
When the outer coating is hot (over 100 degrees C.)
after soldering, it becomes soft and fragile.
Therefore, please be careful not to give it mechanical
stress.
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT
AND CAUSE FUMING OR PARTIAL DISPERSION
WHEN THE PRODUCT IS USED.
c ! Caution (Handling)
Vibration and Impact
Do not expose a capacitor or its lead wires to
excessive shock or vibration during use.
Excessive shock or vibration may cause fatigue
destruction of lead wires mounted on the circuit
board.
Please take measures to hold a capacitor on the
circuit boards by adhesive, molding resin or another
coating.
68
Please con?rm there is no in?uence of holding
measures on the product with the intended equipment.
FAILURE TO FOLLOW THE ABOVE CAUTIONS MAY
RESULT, WORST CASE, IN A SHORT CIRCUIT
AND CAUSE FUMING OR PARTIAL DISPERSION
WHEN THE PRODUCT IS USED.
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