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参数资料
| 型号： | DF2212CUFP24V |
| 厂商： | Renesas Electronics America |
| 文件页数： | 1/3页 |
| 文件大小： | 0K |
| 描述： | MCU 16BIT FLASH 3V 128K 64-LQFP |
| 产品培训模块： | H8S MCU Analog Interface H8S Peripherals Overview H8S On-Chip Flash Memory H8S Microcontroller Timer Peripherals Application-Specific Serial Interfaces in H8S MCU’s General Purpose H8S Microcontroller |
| 标准包装： | 1 |
| 系列： | H8® H8S/2200 |
| 核心处理器： | H8S/2000 |
| 芯体尺寸： | 16-位 |
| 速度： | 24MHz |
| 连通性： | SCI，智能卡，USB |
| 外围设备： | DMA，POR，PWM，WDT |
| 输入/输出数： | 37 |
| 程序存储器容量： | 128KB（128K x 8） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 12K x 8 |
| 电压 - 电源 (Vcc/Vdd)： | 2.7 V ~ 3.6 V |
| 数据转换器： | A/D 6x10b |
| 振荡器型： | 外部 |
| 工作温度： | -20°C ~ 75°C |
| 封装/外壳： | 64-LQFP |
| 包装： | 托盘 |
Dawn of a New Future —
Renesas Electronics
Combining the strengths of
NEC Electronics and
Renesas Technology
Renesas Electronics Corporation—the new company resulting from the April 1, 2010
merger of Renesas Technology Corporation and NEC Electronics Corporation—is a global
semiconductor powerhouse offering a wide range of advanced solutions for a huge
customer base around the world. Besides being the world's top supplier of microcontrollers
with a 30% market share*, we are also a premiere supplier of SoC products,
analog/mixed-signal chips, power devices and much more.
New and existing customers gain signicant advantages from the unprecedented strength,
extensive technology assets, and clear business focus made possible by our recent merger
and invigorated corporate structure.
Renesas’ microcontroller architectures are #1 across diverse markets, and their
extensive use and broad support both facilitate successful system designs and reduce
engineering risk.
Access to the state-of-the-art design and production technologies of the two biggest
Japanese semiconductor companies drives solid product roadmaps and sparks innova-
tion, while top-level commitments to customers protect engineering investments in our
existing architectures.
Being one of the few chipmakers now supporting an ITDM (Integrated Device and
Technology Manufacturer) business model, Renesas Electronics Corporation provides
exceptional levels of quality and exibility by maintaining total control over all aspects
of the products we produce: semiconductor R&D, chip design, and device production,
including processing, packaging and testing.
*MCU Market Share:
Global #1 (30%)
8-bit #1 (20%)
16-bit #1 (36%)
32-bit #1 (38%)
* Source: Gartner 2009 Worldwide
Semiconductor Market Share
Database, March 2010 results
Renesas 8-,16- and 32-bit MCU and MPU Solutions
Offering solid technology roadmaps featuring performance, integration
and power efciency, with complete development tool support
R8C
20MHz
M16C
32MHz
R32C
64MHz
78K0R
20MHz, low power
RX200
50MHz,
ultra-low power
H8
20MHz
H8S
35MHz
H8SX
50MHz
V850
up to 200MHz
SH-2, SH-2A
200MHz
SH-4A
600MHz
RX600
100MHz, low power
32-bit
> High performance
CISC with FPU
16-bit
> Application-
specic integration
> Scalable solutions
for general purpose
32-bit
> Superscalar
and MMU
> Video and audio
processing
8-bit
> Lowest cost MCUs
CISC
RISC
Renesas Electronics America
Solutions Guide
Embedded Systems Conference 2010 Edition
78K0
20MHz
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| DF2212CUNP24V | 功能描述:MCU 16BIT FLASH 3V 128K 64-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2200 产品培训模块:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 标准包装:1 系列:M16C™ M32C/80/87 核心处理器:M32C/80 芯体尺寸:16/32-位 速度:32MHz 连通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外围设备:DMA，POR，PWM，WDT 输入/输出数:121 程序存储器容量:384KB（384K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:24K x 8 电压 - 电源 (Vcc/Vdd):3 V ~ 5.5 V 数据转换器:A/D 34x10b，D/A 2x8b 振荡器型:内部 工作温度:-20°C ~ 85°C 封装/外壳:144-LQFP 包装:托盘 产品目录页面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
| DF2212FP24 | 功能描述:IC H8S MCU FLASH 128K 64LQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2200 产品培训模块:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 标准包装:1 系列:M16C™ M32C/80/87 核心处理器:M32C/80 芯体尺寸:16/32-位 速度:32MHz 连通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外围设备:DMA，POR，PWM，WDT 输入/输出数:121 程序存储器容量:384KB（384K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:24K x 8 电压 - 电源 (Vcc/Vdd):3 V ~ 5.5 V 数据转换器:A/D 34x10b，D/A 2x8b 振荡器型:内部 工作温度:-20°C ~ 85°C 封装/外壳:144-LQFP 包装:托盘 产品目录页面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
| DF2212FP24V | 功能描述:IC H8S MCU FLASH 128K 64LQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2200 标准包装:96 系列:PIC® 16F 核心处理器:PIC 芯体尺寸:8-位 速度:20MHz 连通性:I²C，SPI 外围设备:欠压检测/复位，POR，PWM，WDT 输入/输出数:11 程序存储器容量:3.5KB（2K x 14） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:128 x 8 电压 - 电源 (Vcc/Vdd):2.3 V ~ 5.5 V 数据转换器:A/D 8x10b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:14-TSSOP（0.173"，4.40mm 宽） 包装:管件 |
| DF2212UFP24V | 功能描述:IC H8S MCU FLASH 128K 64LQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2200 产品培训模块:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 标准包装:1 系列:M16C™ M32C/80/87 核心处理器:M32C/80 芯体尺寸:16/32-位 速度:32MHz 连通性:EBI/EMI，I²C，IEBus，IrDA，SIO，UART/USART 外围设备:DMA，POR，PWM，WDT 输入/输出数:121 程序存储器容量:384KB（384K x 8） 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:24K x 8 电压 - 电源 (Vcc/Vdd):3 V ~ 5.5 V 数据转换器:A/D 34x10b，D/A 2x8b 振荡器型:内部 工作温度:-20°C ~ 85°C 封装/外壳:144-LQFP 包装:托盘 产品目录页面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87 |
| DF22-1416PC | 功能描述:电源到板 HI CURRENT CON AWG14 TO 16 INLINE PLG CNT RoHS:否 制造商:TE Connectivity / AMP 系列:5787444 产品类型:Connectors 触点类型: 电压额定值:50 V 电流额定值: 节距: 位置/触点数量:5 安装风格:Through Hole 端接类型: 触点电镀:Tin |
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