参数资料
型号: DF2212CUFP24V
厂商: Renesas Electronics America
文件页数: 3/3页
文件大小: 0K
描述: MCU 16BIT FLASH 3V 128K 64-LQFP
产品培训模块: H8S MCU Analog Interface
H8S Peripherals Overview
H8S On-Chip Flash Memory
H8S Microcontroller Timer Peripherals
Application-Specific Serial Interfaces in H8S MCU’s
General Purpose H8S Microcontroller
标准包装: 1
系列: H8® H8S/2200
核心处理器: H8S/2000
芯体尺寸: 16-位
速度: 24MHz
连通性: SCI,智能卡,USB
外围设备: DMA,POR,PWM,WDT
输入/输出数: 37
程序存储器容量: 128KB(128K x 8)
程序存储器类型: 闪存
RAM 容量: 12K x 8
电压 - 电源 (Vcc/Vdd): 2.7 V ~ 3.6 V
数据转换器: A/D 6x10b
振荡器型: 外部
工作温度: -20°C ~ 75°C
封装/外壳: 64-LQFP
包装: 托盘
Renesas Electronics America Solutions Guide
Embedded Systems Conference 2010 Edition
Renesas Electronics America Inc.
450 Holger Way, San Jose, CA 95134
Tel:408-382-7500 Fax:408-382-7501
am.renesas.com
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0410/1K/JPGraphics/PF/SP
Document Number: R01PF0001EU0100
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RTOS and Middleware support –
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DF2212CUNP24V 功能描述:MCU 16BIT FLASH 3V 128K 64-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2200 产品培训模块:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 标准包装:1 系列:M16C™ M32C/80/87 核心处理器:M32C/80 芯体尺寸:16/32-位 速度:32MHz 连通性:EBI/EMI,I²C,IEBus,IrDA,SIO,UART/USART 外围设备:DMA,POR,PWM,WDT 输入/输出数:121 程序存储器容量:384KB(384K x 8) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:24K x 8 电压 - 电源 (Vcc/Vdd):3 V ~ 5.5 V 数据转换器:A/D 34x10b,D/A 2x8b 振荡器型:内部 工作温度:-20°C ~ 85°C 封装/外壳:144-LQFP 包装:托盘 产品目录页面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
DF2212FP24 功能描述:IC H8S MCU FLASH 128K 64LQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2200 产品培训模块:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 标准包装:1 系列:M16C™ M32C/80/87 核心处理器:M32C/80 芯体尺寸:16/32-位 速度:32MHz 连通性:EBI/EMI,I²C,IEBus,IrDA,SIO,UART/USART 外围设备:DMA,POR,PWM,WDT 输入/输出数:121 程序存储器容量:384KB(384K x 8) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:24K x 8 电压 - 电源 (Vcc/Vdd):3 V ~ 5.5 V 数据转换器:A/D 34x10b,D/A 2x8b 振荡器型:内部 工作温度:-20°C ~ 85°C 封装/外壳:144-LQFP 包装:托盘 产品目录页面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
DF2212FP24V 功能描述:IC H8S MCU FLASH 128K 64LQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2200 标准包装:96 系列:PIC® 16F 核心处理器:PIC 芯体尺寸:8-位 速度:20MHz 连通性:I²C,SPI 外围设备:欠压检测/复位,POR,PWM,WDT 输入/输出数:11 程序存储器容量:3.5KB(2K x 14) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:128 x 8 电压 - 电源 (Vcc/Vdd):2.3 V ~ 5.5 V 数据转换器:A/D 8x10b 振荡器型:内部 工作温度:-40°C ~ 125°C 封装/外壳:14-TSSOP(0.173",4.40mm 宽) 包装:管件
DF2212UFP24V 功能描述:IC H8S MCU FLASH 128K 64LQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2200 产品培训模块:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 标准包装:1 系列:M16C™ M32C/80/87 核心处理器:M32C/80 芯体尺寸:16/32-位 速度:32MHz 连通性:EBI/EMI,I²C,IEBus,IrDA,SIO,UART/USART 外围设备:DMA,POR,PWM,WDT 输入/输出数:121 程序存储器容量:384KB(384K x 8) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:24K x 8 电压 - 电源 (Vcc/Vdd):3 V ~ 5.5 V 数据转换器:A/D 34x10b,D/A 2x8b 振荡器型:内部 工作温度:-20°C ~ 85°C 封装/外壳:144-LQFP 包装:托盘 产品目录页面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
DF22-1416PC 功能描述:电源到板 HI CURRENT CON AWG14 TO 16 INLINE PLG CNT RoHS:否 制造商:TE Connectivity / AMP 系列:5787444 产品类型:Connectors 触点类型: 电压额定值:50 V 电流额定值: 节距: 位置/触点数量:5 安装风格:Through Hole 端接类型: 触点电镀:Tin