参数资料
型号: DF3024F25V
厂商: Renesas Electronics America
文件页数: 8/46页
文件大小: 0K
描述: IC H8/3024 MCU FLASH 100QFP
产品培训模块: Electromagnetic Noise Reduction Techniques Part 1
Digital to Analog Converter Part 1
Digital to Analog Converter Part 2
标准包装: 1
系列: H8® H8/300H
核心处理器: H8/300H
芯体尺寸: 16-位
速度: 25MHz
连通性: SCI,智能卡
外围设备: PWM,WDT
输入/输出数: 70
程序存储器容量: 128KB(128K x 8)
程序存储器类型: 闪存
RAM 容量: 4K x 8
电压 - 电源 (Vcc/Vdd): 3 V ~ 3.6 V
数据转换器: A/D 8x10b; D/A 2x8b
振荡器型: 内部
工作温度: -20°C ~ 75°C
封装/外壳: 100-BFQFP
包装: 托盘
Optimized C/C++ code generation
toolchains
The Renesas compiler toolchains
(compiler, assembler and linker)
support the full C++ language
specification and are backward
compatible with C. They have
extensions for complete embedded
system control directly from C,
without requiring the use of any
assembler code. These extensions
cover:
Interrupt service routines
Condition control register
operations
Sleep instruction
Pseudo functions for instructions
such as multiply-and-accumulate
and decimal add and subtract
Control of the optimized
addressing and function call
features of the device
architecture and instruction set
The inter-module optimizing linker
produces optimized software load
modules by performing global
optimizations on your application.
Free evaluation HEW download
The flexible licensing technology
in Renesas’ compiler toolchains
means you can download a free
evaluation copy of HEW with the
compiler and generate unlimited
code for 60 days. This is very
useful for benchmarking optimiza-
tion efficiency and architecture
performance. After 60 days, code
size is limited to 64 Kbytes, which
still allows you to evaluate the
architecture or experiment with
peripherals. For smaller devices,
you can even complete a full
application, since the evaluation
version is identical to the full
version with the exception of the
code-size
limits,
including
all
optimization options.
HEW Compiler Toolchain Options Dialogs
Software (continued)
14
H8
Family of Microcontrollers
Flash Development Toolkit
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DF3024FBL25V 功能描述:IC H8 MCU FLASH 128K 100QFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300H 标准包装:250 系列:80C 核心处理器:8051 芯体尺寸:8-位 速度:16MHz 连通性:EBI/EMI,I²C,UART/USART 外围设备:POR,PWM,WDT 输入/输出数:40 程序存储器容量:- 程序存储器类型:ROMless EEPROM 大小:- RAM 容量:256 x 8 电压 - 电源 (Vcc/Vdd):4.5 V ~ 5.5 V 数据转换器:A/D 8x10b 振荡器型:内部 工作温度:-40°C ~ 85°C 封装/外壳:68-LCC(J 形引线) 包装:带卷 (TR)
DF3024X25V 制造商:Renesas Electronics Corporation 功能描述:
DF3026F25V 制造商:Renesas Electronics Corporation 功能描述:Bulk
DF3026X25V 功能描述:MCU 3V 256K PB-FREE 100-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300H 产品培训模块:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 标准包装:1 系列:M16C™ M32C/80/87 核心处理器:M32C/80 芯体尺寸:16/32-位 速度:32MHz 连通性:EBI/EMI,I²C,IEBus,IrDA,SIO,UART/USART 外围设备:DMA,POR,PWM,WDT 输入/输出数:121 程序存储器容量:384KB(384K x 8) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:24K x 8 电压 - 电源 (Vcc/Vdd):3 V ~ 5.5 V 数据转换器:A/D 34x10b,D/A 2x8b 振荡器型:内部 工作温度:-20°C ~ 85°C 封装/外壳:144-LQFP 包装:托盘 产品目录页面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87
DF3026XBL25V 功能描述:IC H8 MCU FLASH 256K 100TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8/300H 产品培训模块:CAN Basics Part-1 CAN Basics Part-2 Electromagnetic Noise Reduction Techniques Part 1 M16C Product Overview Part 1 M16C Product Overview Part 2 标准包装:1 系列:M16C™ M32C/80/87 核心处理器:M32C/80 芯体尺寸:16/32-位 速度:32MHz 连通性:EBI/EMI,I²C,IEBus,IrDA,SIO,UART/USART 外围设备:DMA,POR,PWM,WDT 输入/输出数:121 程序存储器容量:384KB(384K x 8) 程序存储器类型:闪存 EEPROM 大小:- RAM 容量:24K x 8 电压 - 电源 (Vcc/Vdd):3 V ~ 5.5 V 数据转换器:A/D 34x10b,D/A 2x8b 振荡器型:内部 工作温度:-20°C ~ 85°C 封装/外壳:144-LQFP 包装:托盘 产品目录页面:749 (CN2011-ZH PDF) 配用:R0K330879S001BE-ND - KIT DEV RSK M32C/87