参数资料
| 型号： | DG3003DB-T1-E1 |
| 厂商： | Vishay Siliconix |
| 文件页数： | 12/13页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH SPST 6-MICRO FOOT |
| 标准包装： | 3,000 |
| 功能： | 开关 |
| 电路： | 1 x SPDT - NC/NO |
| 导通状态电阻： | 700 毫欧 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 1.8 V ~ 5.5 V |
| 电流 - 电源： | 100nA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-WFBGA |
| 供应商设备封装： | 6-Micro Foot? |
| 包装： | 带卷 (TR) |
www.vishay.com
8
Document Number: 72505
S11-0303-Rev. D, 28-Feb-11
Vishay Siliconix
DG3001, DG3002, DG3003
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Product is End of Life
PACKAGE OUTLINE
MICRO FOOT: 6-BUMP (3 x 2, 0.5 mm PITCH, 165 m BUMP HEIGHT)
Notes (Unless Otherwise Specified):
a. Bump is Eutectic 63/57 Sn/Pb or Lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.
Notes:
a. Use millimeters as the primary measurement.
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?72505.
Index-Bump A1
Note c
Top Side (Die Back)
XXX
3003
Recommended Land Pattern
0.5
6 x 0.150
0.229
Note b
Solder Mask
Pad Dia. + 0.1
Silicon
Bump
Note a
b Diameter
32
1
A
B
e
D
e
A
A2
A1
S
E
EUTECTIC (Sn/Pb)
Dim.
Millimetersa
Inches
Min.
Max.
Min.
Max.
A
0.610
0.685
0.0240
0.0270
A1
0.140
0.190
0.0055
0.0075
A2
0.470
0.495
0.0185
0.0195
b
0.180
0.250
0.0071
0.0098
D
1.490
1.515
0.0587
0.0596
E
0.990
1.015
0.0390
0.0400
e
0.5 BASIC
0.0197 BASIC
S
0.245
0.258
0.0096
0.0101
LEAD (Pb)-FREE (Sn/Ag/Cu)
Dim.
Millimetersa
Inches
Min.
Max.
Min.
Max.
A
0.688
0.753
0.0271
0.0296
A1
0.218
0.258
0.0086
0.0102
A2
0.470
0.495
0.0185
0.0195
b
0.306
0.346
0.0120
0.0136
D
1.490
1.515
0.0587
0.0596
E
0.990
1.015
0.0390
0.0400
e
0.5 BASIC
0.0197 BASIC
S
0.245
0.258
0.0096
0.0102
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相关代理商/技术参数 |
参数描述 |
|---|---|
| DG3003-T1 | 制造商:VISHAY 制造商全称:Vishay Siliconix 功能描述:MICRO FOOT 3x2: 0.5-mm PITCH, 0.165-mm BUMP HEIGHT |
| DG300A | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:TTL-Compatible, CMOS Analog Switches |
| DG300A WAF | 制造商:Harris Corporation 功能描述: |
| DG300A/BCA | 制造商:Rochester Electronics LLC 功能描述: |
| DG300A/BIA | 制造商:Rochester Electronics LLC 功能描述: |
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