参数资料
| 型号： | DG3003DB-T1-E1 |
| 厂商： | Vishay Siliconix |
| 文件页数： | 2/13页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH SPST 6-MICRO FOOT |
| 标准包装： | 3,000 |
| 功能： | 开关 |
| 电路： | 1 x SPDT - NC/NO |
| 导通状态电阻： | 700 毫欧 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 1.8 V ~ 5.5 V |
| 电流 - 电源： | 100nA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 6-WFBGA |
| 供应商设备封装： | 6-Micro Foot? |
| 包装： | 带卷 (TR) |
AN824
Vishay Siliconix
Document Number: 71990
06-Jan-03
www.vishay.com
1
PCB Design and Assembly Guidelines
For MICRO FOOTr Products
Johnson Zhao
INTRODUCTION
Vishay Siliconix’s MICRO FOOT product family is based on a
wafer-level chip-scale packaging (WL-CSP) technology that
implements a solder bump process to eliminate the need for an
outer package to encase the silicon die. MICRO FOOT
products include power MOSFETs, analog switches, and
power ICs.
For battery powered compact devices, this new packaging
technology reduces board space requirements, improves
thermal performance, and mitigates the parasitic effect typical
of leaded packaged products. For example, the 6bump
MICRO FOOT Si8902EDB common drain power MOSFET,
which measures just 1.6 mm x 2.4 mm, achieves the same
performance as TSSOP8 devices in a footprint that is 80%
smaller and with a 50% lower height profile (Figure 1). A
MICRO FOOT analog switch, the 6bump DG3000DB, offers
low charge injection and 1.4 W onresistance in a footprint
measuring just 1.08 mm x 1.58 mm (Figure 2).
Vishay Siliconix MICRO FOOT products can be handled with
the same process techniques used for high-volume assembly
of packaged surface-mount devices. With proper attention to
PCB and stencil design, the device will achieve reliable
performance without underfill. The advantage of the device’s
small footprint and short thermal path make it an ideal option
for space-constrained applications in portable devices such as
battery packs, PDAs, cellular phones, and notebook
computers.
This application note discusses the mechanical design and
reliability of MICRO FOOT, and then provides guidelines for
board layout, the assembly process, and the PCB rework
process.
FIGURE 1. 3D View of MICRO FOOT Products Si8902DB and
Si8900EDB
FIGURE 2. Outline of MICRO FOOT CSP & Analog
Switch DG3000DB
0.18 ~ 0.25
32
1
A
B
0.5
1.58
0.5
0.285
1.08
相关PDF资料 |
PDF描述 |
|---|---|
| DG300ACWE | IC SWITCH DUAL SPST 16SOIC |
| DG3015DB-T2-E1 | IC SWITCH LV DUAL 16MICRO FOOT |
| DG303BDJ-E3 | IC SWITCH CMOS 14DIP |
| DG306BDJ-E3 | IC SWITCH CMOS 14DIP |
| DG307ACWE | IC SWITCH DUAL SPDT 16SOIC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| DG3003-T1 | 制造商:VISHAY 制造商全称:Vishay Siliconix 功能描述:MICRO FOOT 3x2: 0.5-mm PITCH, 0.165-mm BUMP HEIGHT |
| DG300A | 制造商:INTERSIL 制造商全称:Intersil Corporation 功能描述:TTL-Compatible, CMOS Analog Switches |
| DG300A WAF | 制造商:Harris Corporation 功能描述: |
| DG300A/BCA | 制造商:Rochester Electronics LLC 功能描述: |
| DG300A/BIA | 制造商:Rochester Electronics LLC 功能描述: |
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