参数资料
| 型号： | DG3015DB-T2-E1 |
| 厂商： | Vishay Siliconix |
| 文件页数： | 7/9页 |
| 文件大小： | 0K |
| 描述： | IC SWITCH LV DUAL 16MICRO FOOT |
| 标准包装： | 3,000 |
| 功能： | 开关 |
| 电路： | 2 x DPDT - NC/NO |
| 导通状态电阻： | 1.2 欧姆 |
| 电压电源： | 单电源 |
| 电压 - 电源，单路/双路(±)： | 2.7 V ~ 3.3 V |
| 电流 - 电源： | 1µA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 16-WFBGA |
| 供应商设备封装： | 16-Micro Foot? |
| 包装： | 带卷 (TR) |
Document Number: 72962
S-70853-Rev. C, 30-Apr-07
www.vishay.com
7
Vishay Siliconix
DG3015
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Product is End of Life
PACKAGE OUTLINE
MICRO FOOT: 16 BUMP (4 x 4, 0.5 mm PITCH, 0.238 mm BUMP HEIGHT)
Notes (Unless Otherwise Specified):
a. Bump is Lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; back-lapped, no coating. Shown is not actual marking; sample only.
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?72962.
Index-Bump A1
Note c
Top Side (Die Back)
XXX
3015
Recommended Land Pattern
0.5
16 X 0.150
0.229
Note b
Solder Mask
Pad Diameter + 0.1
Bump
Note a
32
1
A
B
e
D
e
A
A2
A1
S
E
Silicon
C
D
4
b Diameter
e
Dim.
Millimetersa
Inches
Min.
Max.
Min.
Max.
A
0.688
0.753
0.0271
0.0296
A1
0.218
0.258
0.0086
0.0102
A2
0.470
0.495
0.0185
0.0195
b
0.306
0.346
0.0120
0.0136
D
1.980
2.020
0.0780
0.0795
E
1.980
2.020
0.0780
0.0795
e
0.5 BASIC
0.0197 BASIC
S
0.230
0.270
0.0091
0.0106
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